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Semiconductor device manufacturing method and semiconductor device manufacturing apparatus

A manufacturing method and technology of manufacturing device, which are applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of easy occurrence of pores, high manufacturing cost, and easy mixing of air, so as to reduce material loss and material loss. less effect

Inactive Publication Date: 2007-08-15
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] However, in the manufacturing method of the above-mentioned conventional semiconductor device, regardless of the casting method or the pouring method, there are following disadvantages, that is, the dimensional accuracy of the package is low, and the manufacturing is cumbersome, resulting in high manufacturing cost. Easy to mix with air, prone to pores, etc.
[0018] In addition, in the transfer molding method, the dimensional accuracy can be improved, but since excess resin is generated in the sprue, etc., there is a disadvantage of high material cost

Method used

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  • Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
  • Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
  • Semiconductor device manufacturing method and semiconductor device manufacturing apparatus

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no. 1 approach

[0093] FIG. 1A is a longitudinal cross-sectional view showing an embodiment of a manufacturing apparatus of a semiconductor device according to the present invention. This manufacturing device includes an upper mold 11 , a lower mold 12 relatively close to or separate from the upper mold 11 , and a filling device 20 for filling a liquid resin 17 between the upper mold 11 and the lower mold 12 .

[0094] The above-mentioned upper mold 11 has a plurality of mold cavities 13 . The lower mold 12 has a plurality of cavities 14 and resin storage holes 15 directly connecting the cavities 14 . An injection member 16 reciprocating along the resin storage hole 15 is disposed in the resin storage hole 15 .

[0095] The filling device 20 fills the liquid resin 17 into the cavity 14 and the resin storage hole 15 of the lower mold 12 . The resin 17 is, for example, epoxy resin or silicone resin.

[0096] The upper mold 11 and the lower mold 12 jointly clamp the semiconductor element 30 a...

no. 2 approach

[0108] FIG. 2A shows a second embodiment of the semiconductor device manufacturing apparatus of the present invention. When explaining the difference from the above-mentioned first embodiment, in this second embodiment, the configuration of the filling device is different.

[0109] As shown in FIG. 2A , the filling device 21 of the second embodiment has a filling die 22 and a switch device 25 . The filling mold 22 has a mold main body 23 formed with a resin injection hole 23a, and a gate portion 24 that closes the resin injection hole 23a freely and openably. The above-mentioned liquid resin 17 is filled in the above-mentioned resin injection hole 23a. A hole portion 24 a is formed in the gate portion 24 . Then, the gate part 24 is moved by the opening and closing device 25 so that the hole part 24a of the gate part 24 is overlapped with the resin injection hole 23a of the mold main body 23, and the resin injection hole 23a is opened.

[0110] Next, a method of filling the ...

no. 3 approach

[0115] FIG. 3 shows a third embodiment of the semiconductor device manufacturing apparatus of the present invention. When explaining the points of difference from the above-mentioned first embodiment, in this third embodiment, the configuration of the filling device is different.

[0116] As shown in FIG. 3 , the filling device 26 of the third embodiment has a syringe-shaped resin supply device 27 and a conduit 28 extending from the resin supply device 27 . The above-mentioned liquid resin 17 is filled in the above-mentioned resin supply device 27 . An opening hole 28a is formed in the above-mentioned conduit 28 .

[0117] Next, a method of filling the above-mentioned resin 17 using the filling device 26 will be described.

[0118] The conduit 28 is provided on the lower mold 12 such that the opening 28 a of the conduit 28 overlaps with the cavity 14 of the lower mold 12 . At this time, the conduit 28 is clamped and fixed between the upper mold 11 and the lower mold 12 .

...

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Abstract

The invention provides semiconductor device manufacturing method and semiconductor device manufacturing apparatus. A semiconductor device manufacturing method includes the steps of filling a cavity and a resin reservoir hole in a lower metal mold with a liquid-state resin, holding a semiconductor element between the lower metal mold and an upper metal mold, injecting the resin in the resin reservoir hole into the cavity to seal the semiconductor device with the resin. Thus, the semiconductor device having almost no voids and less material loss is manufactured with high accuracy.

Description

technical field [0001] The present invention relates to a manufacturing method of a semiconductor device and a manufacturing device of the semiconductor device. Background technique [0002] Generally, as a method of manufacturing a semiconductor device, first, as shown in FIG. The semiconductor chip 102 is connected to the lead frame 101 to manufacture a semiconductor element 105 . Next, as shown in FIG. 15C, the above-mentioned semiconductor element 105 is sealed with a resin 104 to manufacture a semiconductor device 106. Then, the semiconductor device 106 becomes a product through exterior plating, lead forming (lead frame processing), electrical characteristic inspection (measurement of various electrical characteristics), marking production, appearance inspection, and packaging. [0003] As the above-mentioned resin 104, a thermosetting resin such as epoxy resin or silicone resin is generally used. As a method of sealing with the above-mentioned resin 104, there are t...

Claims

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Application Information

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IPC IPC(8): H01L21/56
CPCH01L2224/48091H01L2224/48247H01L2224/97H01L2924/181
Inventor 高仓英也
Owner SHARP KK