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Radiating module

A heat dissipation module and heat sink technology, which is applied in cooling/ventilation/heating transformation, instrument cooling, instrument and other directions, can solve the problems of reducing the heat sink, reducing the heat dissipation area of ​​the heat sink, and reducing the heat dissipation effect of the heat sink, achieving Large volume, avoid interference effect

Inactive Publication Date: 2007-08-22
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, reducing the volume of the radiator, that is, reducing the heat dissipation area of ​​the radiator will reduce the overall heat dissipation effect of the heat sink, which cannot meet the heat dissipation requirements.

Method used

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Embodiment Construction

[0014] Please refer to FIGS. 1 to 5 together. An embodiment of the heat dissipation module of the present invention includes a heat transfer plate 100, a heat sink 200 disposed on the heat transfer plate 100, and two heat sinks in contact with the heat transfer plate 100 and the heat sink 200 at the same time. 300 heat pipes.

[0015] The heat transfer plate 100 is made of metal materials with good thermal conductivity, such as copper and aluminum, and it contacts with the electronic components on the circuit board 500 such as the CPU 400 and absorbs the heat generated by the CPU 400 . A pair of parallel grooves 110 are disposed on the upper portion of the heat transfer plate 100 for accommodating the heat pipe 300 and transferring absorbed heat to the heat pipe 300 .

[0016] In contact with the top of the heat transfer plate 100 is a heat sink 200, which includes a base 210, a top plate 220 arranged parallel to the base 210 at intervals, and a heat sink set between the base ...

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Abstract

A heat radiation module is prepared as setting a groove at a side contacting heat conduction plate with heat radiator, forming said heat conduction plate by the first heat conduction section being set with a circular arc unit and a flat unit and being arranged between heat conduction plate and heat radiator as well as the second heat conduction section being arranged far from heat conduction plate and heat radiator.

Description

【Technical field】 [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module used for heat dissipation of electronic components and the like. 【Background technique】 [0002] At present, electronic components such as central processing units will generate a large amount of heat during normal operation, and if the heat generated is not discharged in time, it will cause heat accumulation to cause temperature rise, and seriously affect the normal operation of electronic components. For this reason, the industry usually installs a heat sink on these electronic components for auxiliary heat dissipation. [0003] A typical heat dissipation device is disclosed in Chinese Patent Publication No. 03223425.2. The heat dissipation device includes a heat sink and heat pipes in contact with the heat sink. Wherein the heat sink includes a base which is in contact with the electronic components to be cooled, such as a central processing unit, and s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/427G06F1/20G12B15/00
Inventor 赖振田周志勇刘宜三
Owner FU ZHUN PRECISION IND SHENZHEN