Semiconductor device manufacturing equipment with vacuum system
A vacuum system, vacuum chamber technology, applied in the field of vacuum systems, which can solve the problems of semiconductor device defects, increased maintenance and repair costs, increased equipment downtime, etc.
Inactive Publication Date: 2007-08-29
SAMSUNG ELECTRONICS CO LTD
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Problems solved by technology
Therefore, the exhaust line must be cleaned as a PM (preventive maintenance) section to remove these particles, increasing the amount of time equipment is down
In addition, the particles will flow back into the processing chamber from the exhaust line
This causes defects in semiconductor devices and leads to increased maintenance and repair costs
Method used
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[0035] The present invention can be applied to various types of equipment for processing substrates, the equipment including a chamber and a vacuum device for evacuating the chamber. In particular, the present invention is useful in combination with the processing device of such equipment. However, the present invention can be applied to any vacuum chamber of a substrate processing apparatus in which the pressure needs to be controlled, such as a pre-vacuum chamber or a transfer chamber.
[0036] However, for illustrative purposes only, the present invention will be described in conjunction with a cluster type semiconductor device manufacturing equipment. The cluster-type semiconductor device manufacturing equipment 100 has a plurality of processing devices 102, an alignment device 104, a transfer chamber 108, and a plurality of pre-vacuum units 116. Unit processes (such as thin film processes and etching processes) are executed by the processing device 102. The alignment device 1...
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Semiconductor device manufacturing equipment has a vacuum system that enhances the fluency of the gas being discharged from a chamber of the equipment. The vacuum system has a vent line, and a throttle valve that includes a vent line opening and closing member oriented so that it is readily opened by a concentrated flow of gas in the vent line. The vacuum system may include a heating unit that heats the vent line through which the gas passes. Still further, a bend in the vent line upstream of the vent line opening and closing member may have a gently curved shape and / or may subtend an angle of less than 90 DEG . As a result, the efficiency of the ventilation of the process chamber is improved, making it easier to control the pressure of the process chamber and minimizing the contamination of the throttle valve and the vent line.
Description
Technical field [0001] This application relates to a semiconductor device manufacturing equipment or the like. More specifically, the present invention relates to a vacuum system of semiconductor device manufacturing equipment, the vacuum system including a vent line and a throttle unit for controlling the opening and closing of the vacuum line. Background technique [0002] Generally, semiconductor devices are manufactured by repeatedly and selectively performing many different unit processes on semiconductor substrates, such as wafers. These processes include: ion implantation process, 3B group (such as B) or 5B group (such as P or As) impurity ion implantation into the semiconductor substrate; thin film deposition process, forming a thin material layer on the semiconductor substrate; etching process , The thin material layer is patterned; the process of forming an intermediate insulating layer on the patterned thin material layer; the subsequent chemical mechanical polishing (...
Claims
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IPC IPC(8): H01L21/00H01L21/67H01L21/677H01L21/203H01L21/205H01L21/3065H01L21/31H01L21/311H01J37/18H01J37/32H01J37/00C23C14/56C23C16/54C23F4/00F24V30/00
CPCC23C16/4412C23C14/564H01L21/67017F16K1/22H01L21/02
Inventor 金庆泰崔哲焕金暻台崔准佑
Owner SAMSUNG ELECTRONICS CO LTD