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Electronics module and method for manufacturing the same

An electronic module and electrical connection technology, applied in printed circuit manufacturing, multi-layer circuit manufacturing, circuits, etc., can solve the problems of difficulty in manufacturing, occupying circuit board space, and thickening of electronic module structure.

Active Publication Date: 2011-08-03
IMBERATEK LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to prevent damage to components, through holes cannot be made on the component position on the board, so the through holes will occupy the space of the circuit board
If the components are arranged in double layers, in order to optimize the use of the surface area of ​​the circuit board, the electronic module structure may be disadvantageously thick and complex so that it is difficult to manufacture

Method used

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  • Electronics module and method for manufacturing the same
  • Electronics module and method for manufacturing the same
  • Electronics module and method for manufacturing the same

Examples

Experimental program
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Effect test

Embodiment Construction

[0026] Phase A (with figure 1 )

[0027] In stage A, an appropriate conductor layer 14 is selected as the starting material for the process. A layered sheet, in which the conductor layer 4 is located on the surface of the support substrate 12, can also be chosen as starting material. The layered sheet can be fabricated using, for example, the following steps: selecting a support substrate 12 suitable for processing, and attaching a suitable conductor film to the surface of the support substrate 12 to produce the conductor layer 4 .

[0028] The support base 12 may be formed of a conductive material such as aluminum (Al), or an insulating material such as a polymer. The conductor layer 4 can be manufactured by, for example, attaching a thin metal foil to a surface of the support substrate 12, for example by laminating copper (Cu). The metal foil can be attached to the support substrate, for example, by using an adhesive layer that is applied to the surface of the support su...

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PUM

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Abstract

This publication discloses an electronics module and a method for manufacturing it. The electronics module includes at least one component (6) embedded in an insulating-material layer (1), which has a first contacting surface, in which there are first contact terminals (7), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. In addition, the component (6) has a second contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal (7'), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art.

Description

technical field [0001] The invention relates to an electronic module as claimed in claim 1 , which contains an embedded component. [0002] Such an electronic module may be a module such as a circuit board, and the components contained therein are electrically connected to each other through conductive structures fabricated in the electronic module. The invention relates in particular to an electronic module comprising a microcircuit to which several contact terminals are connected. It is also possible to use other components, such as passive components, in combination with or instead of the microcircuit, embedded in the mounting substrate of the electronic module. [0003] In addition, the invention relates to a method for producing such an electronic module according to the preamble of claim 12 . Background technique [0004] Known methods of embedding components into a mounting substrate during its production have been disclosed in patent applications WO 03 / 065778 and W...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H01L23/538H01L23/367H01L25/065H05K1/02H05K3/40H05K3/46
CPCH01L2224/18H01L2224/82039H01L2224/92144H01L2924/01082H05K3/4611H01L2924/01061H05K1/0206H01L24/18H01L23/3677H01L24/82H01L2924/01005H01L2924/01019H01L2924/01033H01L2924/01006H01L2924/01029H01L2224/83192H01L2924/01078H01L25/0652H01L2924/014H01L2924/01013H05K1/188H01L23/5389H01L24/25H01L2224/16H01L2224/2518H01L2224/82047H05K3/4046H01L2924/07802H01L2224/83005H01L2224/83132H01L2224/32245Y10T29/49139Y10T29/49204Y10T29/49218Y10T29/49128Y10T29/49147H01L2224/04105H01L2224/06181H01L2924/00H05K1/185
Inventor R·托米南A·伊霍拉
Owner IMBERATEK LLC