Illumination device

A lighting device and semiconductor technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of high cost and achieve the effect of reducing graininess
CN101034728AInactive Publication Date: 2007-09-12TOSHIBA LIGHTING & TECH CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOSHIBA LIGHTING & TECH CORP
Publication Date
2007-09-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides a lighting device which can high efficiently extract white light and reduce granular sensation about light source. The lighting device includes: plural semiconductor luminescent components, transparence substrate, transparence bonding layer, reflection member, transparence sealing member, luminophore layer. The luminescent components has semiconductor luminescent layer on back laminated layer of transparence component substrate and extracts the light emitted from the luminescent layer. Lead (conductive portion) of the transparence substrate is connected with p side and n side electrodes of the luminescent component. The backside of the transparence substrate is bonded with surface of component substrate of each luminescent component via the bonding layer. The seal member is arranged at back side of the transparence substrate to seal the luminescent component. The reflection member covers the seal member. The luminophore layer covers the surface of the transparence substrate. The luminophore layer includes luminophore for wavelength convertion of first light emitted by the semiconductor luminescent layer to second light with different wavelength.
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Description

technical field

[0001] The invention relates to an illuminating device which uses a semiconductor light-emitting element such as a light-emitting diode (LED) as a light source to obtain white light. Background technique

[0002] Previously, it is known that a semiconductor light-emitting layer is laminated on the back of a light-transmitting substrate such as sapphire, and an LED chip (semiconductor light-emitting element) that takes out light emitted from the light-emitting layer from the surface of the light-transmitting substrate ( For example, refer to Japanese Patent Application Laid-Open No. 2003-347589).

[0003] In this LED chip, the p-side and n-side electrodes of the semiconductor light-emitting layer are arranged on the side of the semiconductor light-emitting layer opposite to the light-transmitting substrate, so it is called a double wire type semiconductor light-emitting element. Such an LED chip is excellent because the above-mentioned two electrodes are not ...

Claims

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