Illumination device

A lighting device and semiconductor technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of high cost and achieve the effect of reducing graininess

Inactive Publication Date: 2007-09-12
TOSHIBA LIGHTING & TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the formation of ball-shaped solder bumps requires high cost, so other methods that do not require the above-mentioned ball-shaped solder bumps are being sought

Method used

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Embodiment Construction

[0070] A first embodiment of the present invention will be described with reference to FIGS. 1 to 3 .

[0071] In FIG. 1 , reference numeral 1 denotes a lighting device in which an LED package is formed. The lighting device 1 includes a plurality of semiconductor light emitting elements 2 , a translucent substrate 3 , an adhesive layer 4 , a reflection member 5 , a sealing member 6 , and a phosphor layer 7 .

[0072] The semiconductor light-emitting element 2 is, for example, a two-wire LED chip formed using a nitride semiconductor, and is formed by laminating a semiconductor light-emitting layer 12 on the back surface of a light-transmitting, electrically insulating element substrate 11 . The element substrate 11 is made of, for example, a sapphire substrate.

[0073] As shown in FIG. 2, the semiconductor light emitting layer 12 is sequentially stacked with a buffer layer 13, an n-type semiconductor layer 14, a light emitting layer 15, a p-type clad layer (clad layer) 16 and...

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Abstract

The present invention provides a lighting device which can high efficiently extract white light and reduce granular sensation about light source. The lighting device includes: plural semiconductor luminescent components, transparence substrate, transparence bonding layer, reflection member, transparence sealing member, luminophore layer. The luminescent components has semiconductor luminescent layer on back laminated layer of transparence component substrate and extracts the light emitted from the luminescent layer. Lead (conductive portion) of the transparence substrate is connected with p side and n side electrodes of the luminescent component. The backside of the transparence substrate is bonded with surface of component substrate of each luminescent component via the bonding layer. The seal member is arranged at back side of the transparence substrate to seal the luminescent component. The reflection member covers the seal member. The luminophore layer covers the surface of the transparence substrate. The luminophore layer includes luminophore for wavelength convertion of first light emitted by the semiconductor luminescent layer to second light with different wavelength.

Description

technical field [0001] The invention relates to an illuminating device which uses a semiconductor light-emitting element such as a light-emitting diode (LED) as a light source to obtain white light. Background technique [0002] Previously, it is known that a semiconductor light-emitting layer is laminated on the back of a light-transmitting substrate such as sapphire, and an LED chip (semiconductor light-emitting element) that takes out light emitted from the light-emitting layer from the surface of the light-transmitting substrate ( For example, refer to Japanese Patent Application Laid-Open No. 2003-347589). [0003] In this LED chip, the p-side and n-side electrodes of the semiconductor light-emitting layer are arranged on the side of the semiconductor light-emitting layer opposite to the light-transmitting substrate, so it is called a double wire type semiconductor light-emitting element. Such an LED chip is excellent because the above-mentioned two electrodes are not ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L25/00H01L25/075
CPCH01L2224/49107H01L2224/48091H01L2224/48463H01L2224/73265
Inventor 三瓶友広川岛净子齐藤明子泉昌裕田村畅宏岩本正己塩崎满野木新治
Owner TOSHIBA LIGHTING & TECH CORP
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