Making method for the image module with the sensor directly connected and encapsulated together with the soft board

Abstract

This invention discloses methods of production soft image sensor plate connecting directly with the video package module, the characterized of it lies in, it include the following steps: first open a hole in the soft board corresponding image sensor chips installed, take a seat and imaging module size with the reinforcement plate, its fixed the hole in the soft dorsal plate; Image sensor then chip placed in the soft-hole plate, and reinforcement plate fixed link to a video sensor chip with the pin counterparts soft circuit board electrical connectors; Block and the installation of the final lens elements for imaging module package. This invention do not need to use a printed circuit board package, which on only lowered the image of the highly modular, but also saving the cost, improved cooling effect; And connectivity flexibility, customers can choose according to the specific application.

Description

technical field [0001] The invention relates to a method for packaging an image module of a small electronic product, in particular a method for directly connecting and packaging an image sensor to a soft board without using a printed circuit board. Background technique [0002] As an accessory of small electronic products, video module (i.e., camera module) is widely used in electronic products with camera functions such as digital cameras, mobile phones with camera functions, or personal digital assistants with camera functions such as PDAs. It is increasingly miniaturized, so how to reduce its package size and facilitate its connection with other parts of electronic products has become the center of people's attention. [0003] In the prior art, an image module includes: a lens unit, a base, a printed circuit board (PCB for short) and an image sensor. The image sensor chip is arranged on the upper surface of the printed circuit board, and the pi...

AI Technical Summary

Problems solved by technology

However, due to the high temperature treatment required in the surface mount process, the base body and lens unit of the image module need to be made of heat-resistant materials, or the base body needs to be divided into separate structures and connected after mounting, which will Resulting in an increase in cost and complexity of the process

[0005] On the other hand, the above-mentioned image module integrated with the printed circuit board is difficult to further reduce the packaging height due to the thickness limit of the printed circuit board, which limits the application of the image module in miniaturized electronic products.

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