Making method for the image module with the sensor directly connected and encapsulated together with the soft board

A technology of an image module and a manufacturing method, which is applied in image communication, semiconductor devices, components of color TVs, etc., can solve the problems of complicated process, limitation of image modules, reduction of packaging height, etc., and achieves good heat dissipation effect, Height reduction, cost saving effect
CN101035199AInactive Publication Date: 2007-09-12昆山钜亮光电科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
昆山钜亮光电科技有限公司
Publication Date
2007-09-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

This invention discloses methods of production soft image sensor plate connecting directly with the video package module, the characterized of it lies in, it include the following steps: first open a hole in the soft board corresponding image sensor chips installed, take a seat and imaging module size with the reinforcement plate, its fixed the hole in the soft dorsal plate; Image sensor then chip placed in the soft-hole plate, and reinforcement plate fixed link to a video sensor chip with the pin counterparts soft circuit board electrical connectors; Block and the installation of the final lens elements for imaging module package. This invention do not need to use a printed circuit board package, which on only lowered the image of the highly modular, but also saving the cost, improved cooling effect; And connectivity flexibility, customers can choose according to the specific application.
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Description

technical field

[0001] The invention relates to a method for packaging an image module of a small electronic product, in particular a method for directly connecting and packaging an image sensor to a soft board without using a printed circuit board. Background technique

[0002] As an accessory of small electronic products, video module (i.e., camera module) is widely used in electronic products with camera functions such as digital cameras, mobile phones with camera functions, or personal digital assistants with camera functions such as PDAs. It is increasingly miniaturized, so how to reduce its package size and facilitate its connection with other parts of electronic products has become the center of people's attention.

[0003] In the prior art, an image module includes: a lens unit, a base, a printed circuit board (PCB for short) and an image sensor. The image sensor chip is arranged on the upper surface of the printed circuit board, and the pi...

Claims

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