Packaging method for optical film overlap

A packaging method and optical film technology, applied in packaging, wrapping paper, transportation packaging, etc., can solve the problems of sticking to the surface of optical film, troublesome and so on

Inactive Publication Date: 2007-09-26
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, this method is cumbersome, and it is desired to develop a simpler optical film laminate that does not cause damage to the original shape of the optical film laminate, and does not cause foreign matter such as dust to enter, and the adhesive layer to adhere to the package. Unfavorable situations where the adhesive layer is missing from the film and the adhesive adheres to the surface of the optical film

Method used

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  • Packaging method for optical film overlap
  • Packaging method for optical film overlap
  • Packaging method for optical film overlap

Examples

Experimental program
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Embodiment 1

[0076] The optical film laminate was packaged using the same packaging device as shown in FIG. 3 .

[0077] (1) Optical film laminated body: Polarizing film SRF862APG6-S / 81 (manufactured by Sumitomo Chemical Co., Ltd.) was cut into 400 mm long x 300 mm wide, and 20 sheets were stacked.

[0078] (2) Packaging film: polyethylene shrink film (manufactured by Okura Kogyo Co., Ltd.), 15 μm in thickness, and 500 mm in width after being folded in half.

[0079] (3) Protective sheet: length 400mm×width 300mm×thickness 1mm, with a pear skin pattern on the surface.

[0080] (4) Packing machine: L-shaped packing machine (manufactured by Natsunki Koichi Co., Ltd.)

[0081] The optical film laminate was inserted between the packaging films folded in half at a distance of about 7 mm in the longitudinal direction and about 4 mm in the width direction, and the packaging films were heat-sealed to obtain a film packaging body.

[0082] Send it into the hot air stove, with about 1Nm 3 / cm 2 ...

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Abstract

The invention provides a more simple packaging process of optical film overlapping element, without destruction of original shape of optical film overlapping element and deletion of adhesive layer and adhesion of adhesive to the surface of the optical film arised by interfusion of foreigh matters such as dust and adhesion of adhesive layer to packaging film. The invention is a packaging process of optical film overlapping element trough packaging the overlapping and multichip optical film by packaging film, comprising the following steps: inserting the optical film overlapping element up and down allocated with protecting film between the up and down packaging films; heat sealing the perimeter of the optical film overlapping element and fusing into film packaging body and heating the film packaging body to thermally shrink the external packaging film.

Description

technical field [0001] The present invention relates to a package and a packaging method of an optical film laminate. In detail, it relates to a simpler packaging method for optical film laminates, which does not cause damage to the original shape, does not cause foreign matter such as dust to mix in, and does not cause the adhesive layer to adhere to the packaging film and cause the adhesive layer to be damaged. Inappropriate conditions such as missing, adhesive adhered to the surface of the optical film, etc. Background technique [0002] Optical films such as polarizing films, polarizing separation films, and phase difference films, or optical films laminated with multiple sheets of these optical films are used as an optical component of a liquid crystal display device, and are generally used as an optical component that matches the screen of a liquid crystal display device. The shape of the rectangular optical film is used. [0003] For such an optical film (1), usuall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B9/02B65B51/10B65B51/30B65B53/06G02B5/30
Inventor 那须拓郎水野克司白石裕一
Owner SUMITOMO CHEM CO LTD
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