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Substrate treatment apparatus and substrate treatment method

A substrate processing device and substrate technology, applied to chemical instruments and methods, cleaning methods and tools, cleaning methods using tools, etc., can solve problems such as uneven cleaning width, deviation of pressing force, and uneven cleaning degree

Inactive Publication Date: 2007-10-03
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009]However, in each of the structures proposed above, depending on the position of the substrate relative to the cleaning brush, the pressing force of the cleaning brush on the outer peripheral end surface of the substrate may deviate, which may cause cleaning unevenness or uneven cleaning width, etc.

Method used

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  • Substrate treatment apparatus and substrate treatment method
  • Substrate treatment apparatus and substrate treatment method
  • Substrate treatment apparatus and substrate treatment method

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Embodiment Construction

[0035] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0036] Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. In addition, FIG. 2 is a side view illustrating the inside of the substrate processing apparatus shown in FIG. 1.

[0037]This substrate processing apparatus 1 is a single-wafer type apparatus that processes semiconductor wafers W (hereinafter simply referred to as "wafer W") as an example of a substrate one by one. The substrate processing apparatus 1 has in the processing chamber 2 partitioned by partition walls: a spin chuck 3 for holding and rotating the wafer W approximately horizontally; and a surface nozzle 4 for facing the surface of the wafer W ( The surface on the side where the device is formed, the upper surface in this embodiment) supplies processing liquid; the back surface nozzle 5, which is used to ...

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Abstract

A substrate treatment apparatus and substrate treatment method of the present invention includes a substrate holding mechanism for holding a substrate, a brush made of an elastically deformable material and having a cleaning surface intersecting a parallel direction along one surface of the substrate held by the substrate holding mechanism, a brush moving mechanism for moving the brush with respect to the substrate held by the substrate holding mechanism, a control unit for controlling the brush moving mechanism so that the cleaning surface is made to contact with the peripheral end face of the substrate held by the substrate holding mechanism, and a pushing pressure holding mechanism for holding the pushing pressure of the brush to the peripheral end face of the substrate in the parallel direction at a preset pushing pressure.

Description

Technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method for cleaning a substrate. The substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, and optical disks. Substrates for masks, etc. Background technique [0002] In the manufacturing process of the semiconductor device, the contamination of the peripheral portion of the semiconductor wafer may have a non-negligible effect on the processing quality of the semiconductor wafer. [0003] In the so-called batch processing step, a plurality of semiconductor wafers are immersed in a processing liquid in a vertical position. Therefore, if a contaminant adheres to the peripheral portion of the semiconductor wafer, the contaminant diff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B1/00B08B1/04B08B7/04B08B3/04H01L21/00H01L21/30H01L21/67G11B7/26H01L21/304
CPCB08B1/04H01L21/02087H01L21/67046B08B1/36H01L21/304B08B1/32
Inventor 平冈伸康奥村刚仲野彰义
Owner DAINIPPON SCREEN MTG CO LTD