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Flexible substrate

A flexible substrate, high elasticity technology, applied in the direction of electrical components, printed circuit components, printed circuits, etc., can solve problems such as difficult multi-layering, lack of heat resistance and moisture resistance of flexible substrates, rigid substrates cannot be deformed, etc.

Inactive Publication Date: 2007-10-17
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that wire bonding or soldering used for rigid substrates is difficult to mount
In addition, conventional flexible substrates lack heat resistance and moisture resistance, and are easily deformed due to expansion, so multilayering is difficult.
[0006] On the other hand, since the rigid substrates used in the past cannot be deformed, they cannot be used for movable parts of portable devices like flexible substrates.

Method used

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Experimental program
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Embodiment Construction

[0023] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0024] FIG. 1 is a cross-sectional view showing the structure of a flexible substrate 10 according to the embodiment. The flexible substrate 10 includes a first wiring layer 20, an insulating resin layer 30, a glass fiber cloth 40, and a second wiring layer 50.

[0025] The first wiring layer 20 and the second wiring layer 50 are made of metal such as copper, and each has a predetermined wiring pattern. For example, after a copper foil is pressed on the insulating resin layer 30, a resist matching a predetermined wiring pattern is formed on the copper foil by photolithography, and the copper foil is selectively etched using the resist as a mask. Thereby, the above-mentioned first wiring layer 20 and second wiring layer 50 can be obtained.

[0026] The insulating resin layer 30 is formed of an insulating material having high elastic modulus, heat resistance, and moisture res...

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Abstract

A flexible substrate is provided which contains not only flexibility but also rigidity and hear resistance. A flexible substrate includes a first wiring layer, an insulating resin layer, a glass cloth and a second wiring layer. The insulating layer is formed by an insulating material, such as a BT resin, epoxy resin or the like that contains a high elastic modulus, heat resistance and moisture resistance. The film thickness of the insulating resin layer is thinned down to about 60 mum. As a reinforcing material, the glass cloth is embedded in the insulating resin layer. With this structure, the flexible substrate attains flexibility and at the same time in any of the first wiring layer and the second wiring layer, circuit elements can be mounted both on a curved area and a non-curved area of the wiring layers.

Description

Technical field [0001] The present invention relates to a flexible substrate (flexible substrate) known as a wiring substrate having flexibility. More specifically, the present invention relates to a flexible substrate suitable for mounting circuit elements. Background technique [0002] In recent years, with the miniaturization and high-functioning of electronic equipment, the miniaturization, high-density, and multifunctionalization of circuit devices used in electronic equipment have been continuously promoted. In addition, in order to arrange a plurality of circuit devices in the housing of an electronic device, a flexible wiring board called a flexible board is used for wiring of the circuit device. By using a flexible substrate, it is possible to increase the degree of freedom in the configuration of the circuit device, and more circuit devices can be packed in a narrow casing. [0003] For example, flexible substrates are provided with flexibility to be used for connection...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K1/02
Inventor 村井诚臼井良辅
Owner SANYO ELECTRIC CO LTD