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Radiating device

A heat sink and heat sink technology, which is applied in cooling/ventilation/heating transformation, instrument cooling, instruments, etc., can solve problems such as solder overflow, affect the heat dissipation effect of the heat sink, and the joint between the heat pipe and the heat sink is not tight. tight effect

Inactive Publication Date: 2007-11-14
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is likely to cause the solder to overflow due to scratching and extrusion, resulting in a loose joint between the heat pipe and the heat sink, which ultimately affects the heat dissipation effect of the heat sink

Method used

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Examples

Experimental program
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Embodiment Construction

[0018] FIG. 1 is an exploded perspective view of the first embodiment of the heat sink of the present invention. The heat dissipation device 100 includes a plurality of heat sinks 10 and a plurality of heat pipes 20 . These heat pipes 20 are curved U-shaped structures, and two ends of the heat pipes pass through the heat sink 10 .

[0019] Please refer to FIG. 1 to FIG. 3 , the heat sinks 10 are respectively provided with a plurality of connection holes 12 for passing through the heat pipes 20 . These cooling fins 10 are provided with a number of abutting tops 14, through which these abutting tops 14 abut against the previous cooling fins 10, thereby forming flow passages between adjacent cooling fins 10 for refrigerant fluid (such as the gas generated by a cooling fan) flow past. A through hole 16 is correspondingly provided in the middle of these heat sinks 10 , and the through hole 16 communicates the flow channels between the heat sinks 10 , which can reduce the flow res...

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PUM

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Abstract

The heat sink includes at least a heat pipe and some thermal fins. Connection holes setup on these thermal fins are for heat pipes to pass through. Joint portions are set up at places extended from one side of circumferences of the connection holes. A gap is setup on the joint portion of the connection hole. A diversion extraction bud is setup at two ends on the gap corresponding to thermal fins respectively. These diversion extraction buds are connected to the joint portion of the connection holes. Thus, joint between thermal fin and heat pipe is tight.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device composed of a heat pipe and a heat dissipation fin. Background technique [0002] With the rapid development of the computer industry, heat-generating electronic components such as central processing units generate more and more heat. In order to dissipate the heat effectively, the usual method is to use one end of a heat pipe to contact with the heat-generating electronic component to export the heat generated by the heat-generating electronic component. Distribute quickly. Wherein, these cooling fins are connected with the heat pipes by setting perforations. In order to increase the contact area between these cooling fins and the heat pipes, usually a joint part is integrally extended on the periphery of these cooling fins perforations, so as to closely adhere to the outer wall of the heat pipes. . In order to reduce the interface thermal resistance betw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/427G06F1/20G12B15/06
Inventor 张晶林雨利陈进龙郝明亮杨明
Owner FU ZHUN PRECISION IND SHENZHEN