Film forming device and method

A film-forming device and film-forming method technology, applied in coating, gaseous chemical plating, metal material coating process, etc., can solve the problems of deterioration of film-forming production efficiency, reduction of vaporization, obstruction of raw gas, etc. The effect of good thickness distribution and improved production efficiency

Inactive Publication Date: 2008-01-02
HORIBA LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, there is also a problem that stable supply of raw material gas with a uniform concentration to the substrate and film formation on the substrate are hindered due to clogging of the shower orifice or film formation on the partition plate, etc.
[0006] Further, there is a problem that when the liquid raw material is supplied intermittently, the amount of vaporization per unit time decreases, and the production efficiency of film formation deteriorates.

Method used

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  • Film forming device and method

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no. 2 Embodiment

[0055] Next, a second embodiment of the film forming apparatus of the present invention will be described with reference to the drawings.

[0056] When a plurality of injection valves 3 are opened and closed at the same time as in the first embodiment, the amount of spray supplied at one time increases. In this case, the pressure fluctuation in the film forming chamber 2 increases. In order to completely vaporize the liquid raw material, it is necessary to increase the capacity of the vacuum pump 7 to keep the pressure in the film forming chamber 2 constant.

[0057] Therefore, the method of controlling the injection valve 3 of the film forming apparatus 1 of the present embodiment is different from that of the first embodiment. That is, in the film forming apparatus 1 of the present embodiment, the control device 10 makes the timing of opening and closing of the respective injection valves 3 different, and closes the injection valves 3 in turn.

[0058] The specific control metho...

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Abstract

The film forming device of the present invention is a film forming device which vaporizes the liquid charging stock and accumulates it to the substrate to form the film, it is characterized in that it includes the following components: a film forming chamber (2) which holds the substrate (W) interiorly and a plurality of injection valves (3) which are arranged at different positions of the film forming chamber (2) and directly directs the same liquid charging stock into the film forming chamber (2) and vaporize and supply the liquid charging stock by decompressing and boiling it. The adopting of the invention can realize the miniaturization of the film forming chamber further realizes the miniaturization of the film forming device and cause the distribution of depth of the formed film good and the vaporization amount large to increase the production efficiency of film forming.

Description

Technical field [0001] The present invention relates to a film forming device and a film forming method, and more particularly to a film forming device and a film forming method using a chemical vapor growth method. Background technique [0002] In this type of film forming apparatus, for example, there is such an apparatus. As shown in Patent Document 1 (Japanese Patent Laid-Open No. 2004-197135), an injection valve (injector) for ejecting a liquid raw material is provided in the upper part of the film forming chamber. , Spray the liquid raw material directly into the film forming chamber to form a film on the substrate. At this time, the liquid raw material injected from the injection valve boils under reduced pressure and vaporizes. [0003] However, in order to spray the liquid material over the entire substrate using one injection valve, it is necessary to sufficiently leave the distance between the injection valve and the substrate. In this case, the distance between the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/00
CPCC23C16/45523C23C16/4486C23C16/448H01L21/205
Inventor 千田二郎大岛元启清水哲夫富永浩二松田耕一郎山岸丰
Owner HORIBA LTD
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