Exposure method, exposure apparatus, and device manufacturing method

A technology of exposure device and exposure method, applied in the field of device manufacturing, capable of solving problems such as damage, unevenness of optical characteristics, defects, etc.

Inactive Publication Date: 2008-01-02
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The damage of this film will become the main cause of the non-uniformity of the optical characteristics of the damaged part and other parts, and water marks (watermarks), etc., which may result in a decrease in measurement accuracy.
In addition, due to the charging, foreign matter is adsorbed on the surface of the object (part), and liquid (pure water), wafers, etc. are contaminated by the foreign matter, and defects such as poor exposure may also occur.
[0007] Furthermore, when an immersion region is formed on an object (for example, a w

Method used

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  • Exposure method, exposure apparatus, and device manufacturing method
  • Exposure method, exposure apparatus, and device manufacturing method
  • Exposure method, exposure apparatus, and device manufacturing method

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Embodiment Construction

[0025] Next, an embodiment of the present invention will be described based on FIGS. 1 to 6 .

[0026] FIG. 1 schematically shows the configuration of an exposure apparatus 100 according to an embodiment. The exposure apparatus 100 is a scanning exposure apparatus of a step-and-scan method, that is, a so-called scanner.

[0027] The exposure apparatus 100 includes: an illumination system ILS; and a master stage RST that holds a master R and moves in a predetermined scanning direction (here, the left-right direction in FIG. 1 , that is, the Y-axis direction). The master is a mask illuminated by the exposure light IL as an energy beam from the illumination system ILS; the projection unit PU includes projection optics for projecting the exposure illumination light IL emitted from the master R onto the wafer W; System PL; stage device 150 including wafer stage WST as an object stage on which wafer W is placed; measurement stage MST used for measurement for exposure; and their con...

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Abstract

An immersion apparatus (132) is provided with a mixing mechanism for mixing a prescribed substance with a liquid supplied on a liquid-repellent film on the surface of an object (member) arranged on a light outgoing side of a projection optical system (PL) and dissolving the substance. The prescribed substance adjusts the specific resistivity of the liquid. A liquid (Lq) wherein the prescribed substance is dissolved is supplied on the liquid-repellent film and an immersion region is formed.

Description

technical field [0001] The present invention relates to an exposure method and an exposure device, and a device manufacturing method, and more particularly, to an exposure method and an exposure device for exposing an object by means of a liquid, and a device manufacturing method using the above exposure method and exposure device in a photolithography process. Background technique [0002] Conventionally, in the photolithography process for manufacturing electronic devices such as semiconductor elements (integrated circuits, etc.), liquid crystal display elements, etc., the following equipment is mainly used, that is, the pattern image of the mask (or master) is transferred separately by an optical projection system. Step-and-repeat reduction projection exposure device (so-called stepper exposure device ); or a step-and-scan projection exposure device (so-called scanning stepper (also called a scanner)), etc. [0003] In this kind of projection exposure apparatus, higher r...

Claims

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Application Information

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IPC IPC(8): H01L21/027
Inventor 白石健一星加隆一藤原朋春
Owner NIKON CORP
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