Shape memory epoxy resin system

An epoxy resin system and epoxy resin technology, applied in the field of shape memory materials, can solve problems such as difficulty in carrying large-scale space structures, and achieve the effects of wide deformation and recovery temperature, long storage period, and low cost.

Inactive Publication Date: 2008-01-09
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a shape memory epoxy resin system in order to solve the problem of difficulty in carrying large space structures

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0010] Embodiment 1: In this embodiment, the shape memory epoxy resin system is made of epoxy resin and curing agent, and the weight ratio of epoxy resin to curing agent is 100:13.55~22.75; the epoxy resin is bisphenol Type A epoxy resin or bisphenol A type epoxy and aliphatic epoxy blend resin, wherein bisphenol A type epoxy resin is bisphenol A type epoxy resin E-51 or bisphenol A type epoxy resin E- 44. The aliphatic epoxy resin is polypropylene glycol diglycidyl ether or polyethylene glycol diglycidyl ether; the curing agent is an amine curing agent, and the amine curing agent is p, p'-diamino-diphenyl - Methane.

specific Embodiment approach 2

[0011] Embodiment 2: In this embodiment, the weight ratio of the epoxy resin to the curing agent is 100:14.15˜17.7. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0012] Embodiment 3: In this embodiment, the weight ratio of the epoxy resin to the curing agent is 100:15.17. Others are the same as in the first embodiment.

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Abstract

A shape-memory epoxy-resin system consists of epoxy-resin and curing agent in proportion of 100:13.55-22.75; epoxy-resin is bisphenol A epoxy resin or bisphenol A epoxy and fatty epoxy blend resin, curing agent is p-p'-diamino-diphenyl-methane. It's light, efficient and non-toxic, and has less folding and packing volume, long storage period. It can be used for ultra-large spatial structure materials.

Description

technical field [0001] The invention relates to a shape-memory material, in particular to a shape-memory thermosetting resin material for space structures. Background technique [0002] With the continuous deepening of human utilization of space resources, there is a strong demand for large-scale space structures. Near and future spacecraft require the use of large structures and components, such as space science observatories, antennas, solar arrays, etc. designed to build large structures. However, these large-scale space structures are difficult to carry. In order to be able to load these large-scale structures with existing launch vehicle stacks, large-scale ultra-lightweight structures and components are required, which can be effectively folded and packaged before launch, and can be reliably deployed on space orbits. . Thermosetting resin-based shape memory composite material technology is a new material technology that has just been researched and developed in recen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K5/19C08K3/36
Inventor 刘宇艳赖学平万志敏杜星文
Owner HARBIN INST OF TECH
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