Anisotropic electrically conductive structure

Abstract

An anisotropic electrically conductive structure comprising: a dielectric matrix having a first surface and a second surface; a heat curable adhesive layer disposed on at least one or both of said first surface and said second surface; a plurality of passages at least extending from said first surface of said matrix to said second surface of said matrix; and electrically conductive members in said passages; wherein said dielectric matrix does not exhibit thermal fluidization at a temperature required for heat curing of said heat curable adhesive layer.

Description

technical field [0001] The invention relates to an anisotropic conductive structure. Background technique [0002] Precision electronic components, such as integrated circuit chips or devices, terminal pads of printed circuit boards, liquid crystal displays, etc., have electrical connection parts for connection with external circuits. In the case of connecting a chip to an external circuit, in particular, these electrical connection parts exist in high density, and the pitch of each of these electrical connection parts from an adjacent part is generally 0.1 mm or less. These high-density electrical connection parts must be electrically insulated from adjacent parts in order to avoid short circuits between them. Therefore, anisotropic conductive structures that conduct electricity in only one direction and are electrically insulating in the other direction have been commonly used in these connection components. [0003] There are various known documents on anisotropic condu...

AI Technical Summary

Problems solved by technology

However, it is not always easy to maintain insulation between conductive paths as these materials soften and may fluidize when connected

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