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Method and apparatus for rinsing a substrate during lithographic development processing

A processing method and substrate technology, which can be applied in photography, photographic process of patterned surface, optics, etc., can solve the problem of excessive developer consumption, and achieve the effect of shortening the time and reducing the consumption

Inactive Publication Date: 2008-04-09
株式会社迅动
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, too much developer

Method used

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  • Method and apparatus for rinsing a substrate during lithographic development processing
  • Method and apparatus for rinsing a substrate during lithographic development processing
  • Method and apparatus for rinsing a substrate during lithographic development processing

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Embodiment Construction

[0031] Hereinafter, specific embodiments of the invention will be described with reference to the drawings.

[0032] 1 and 2 show an example of the structure of a development treatment apparatus used for implementing the substrate development treatment method of the present invention. FIG. 1 shows a longitudinal sectional view of the schematic structure of the development treatment apparatus, and FIG.

[0033] This development processing apparatus has: a spin chuck 10 that holds the substrate in a horizontal posture; a rotation support shaft 12 that fixes and vertically supports the spin chuck 10 at an upper end; A rotary motor 14 that rotates the disk 10 and the rotary shaft 12 around a vertical axis. The circular cup 16 is arranged around the spin chuck 10 so as to surround the substrate W on the spin chuck 10 . The cup 16 is supported in a vertically reciprocating manner by a support mechanism (not shown), and a drain pipe 18 is connected to the bottom of the cup 16 .

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Abstract

The invention provides a method capable of eliminating occurrence of concentration difference in developer depending on position on a substrate surface when a developer on the substrate is replaced with a rinse; preventing occurrence of stain-like defects on a resist film surface; and reducing amount used of the developer. While a substrate is being rotated about a vertical axis by a rotation motor with held in a horizontal posture by a spin chuck, after the developer has been fed onto the resist film on the substrate surface from a developer discharge nozzle to conduct processing, the substrate continues to be rotated and thus the developer on the resist film is dispersed by a centrifugal force to be removed, and thereafter a rinse is fed onto the resist film from a rinse discharge nozzle to conduct rinsing.

Description

technical field [0001] The present invention relates to a substrate that is developed by supplying a developing solution to an exposed resist film formed on the surface of a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, or a substrate for an optical disc. A development processing method and a development processing device. Background technique [0002] In the manufacturing process of semiconductor devices, etc., circuit patterns are formed on the resist film on the surface of the substrate through the following steps. The exposure machine prints circuit diagrams on the resist film on the surface of the substrate, and then develops the exposed resist film with a developer. Among them, in the developing process, for example, while the substrate is held in a horizontal posture and rotated around a vertical axis, the developer is continuously discharged from the discharge port at the tip of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/30G03F7/40H01L21/027
CPCG03F7/3021G03F7/3057H01L21/67051
Inventor 春本将彦山口晃久井章博
Owner 株式会社迅动