Glass substrate homogenizing and thinning device

Abstract

This invention relates to an equipment for thinning glass substrate evenly. It is composed of: an etching circulation trough, a mechanism for fixing the substrates and a Bynuli oscillation mechanism. The etching circulation trough is used for holding or replacing etchant; said fixing mechanism is used for fixing several sheets of glass substrates in said trough; said oscillation mechanism, linked with said trough, makes the substrates acting in oscillation. This invention makes even etching of glass substrates and lower the gasification of hydrofluoric acid.

Description

technical field [0001] The present invention relates to an etching technology for uniform thinning of glass substrates, in particular to a method for densely arranging glass substrates in grooves to achieve a more uniform surface etching effect and reducing the gasification of hydrofluoric acid (HF) , to avoid the outward divergence, evaporation and gasification of hydrofluoric acid gas (that is, hydrogen fluoride), which causes the problem of corroding the metal components of the machine, and avoids the high-density etched glass substrate uniform thinning device whose toxicity is harmful to the human body. Background technique [0002] In the past, flat-panel displays used glass substrates. It is very important to uniformly thin the glass substrate in the manufacturing process. The known and feasible methods are all achieved by wet etching. [0003] As the technology disclosed in Taiwan Patent Announcement No. 543113 "Automatic Etching Device and Etching Method of Glass Sub...

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Problems solved by technology

[0003] As the technology disclosed in Taiwan Patent Announcement No. 543113 "Automatic Etching Device and Etching Method of Glass Substrate for TFT LCD", it is to be provided with a porous bubbling device inside the etching tank, and set the upper side of the bubbling device. There is a striking device, and a lot of nitrogen gas (N 2 ) bubbles to stir the hydrofluoric acid (HF) etching solution, this method is affected by the physical phenomenon of fluid mechanics, cannot produce an ideal flow field, and there will be a problem of increased HF vaporization

Therefore, in order to prevent toxic HF gas from being emitted outward during etching, an air curtain device is installed. Although there is an air curtain device to isolate the outside environment, it still cannot solve the problem of machine metal components being corroded by HF. And cause serious human hazards, industrial safety and environmental problems

[0004] In addition, the nitrogen gas bubbling device (N 2 buble) and the flow guide device only consider the fluency characteristics, and have not considered whether there is sufficient and complete fluid shear force and inertial force after the glass substrate is etched by HF to remove the residual and precipitated fluorosilicate particles on the surface of the glass substrate. Particles remaining on the surface of the glass substrate will not only affect the etching speed, but also affect the uniformity of etching

[0005] It can be seen that the above-mentioned existing glass substrate uniform thinning device obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general products do not have a suitable structure to solve the above problems. This is obviously the relevant industry. Urgent problem

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