High speed bend test device

A bending test, high-speed technology, used in the testing of measuring devices, machines/structural components, and the use of repetitive force/pulse force to test the strength of materials, etc. , easy to adjust effect

Inactive Publication Date: 2008-04-23
NIPPON MEKTRON LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it takes a long time, and there is also the problem that the life and the number of bendings are increased due to the wear and tear of the operating system of the test device itself, that is, the life is shortened in inverse proportion to the increase in speed.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] FIG. 1 is an overall structural diagram of the high-speed bending test apparatus of the present invention. A high-speed bending test apparatus (hereinafter simply referred to as a "test apparatus") 10 is composed of the following components and the like: a pair of left and right fixing plates 12 to which one end portion of the flexible printed circuit board 11 to be bent is fixed; The left and right fixed plates 12 are arranged in parallel with the fixed plate 12 at a predetermined distance, and the other end of the flexible printed circuit board 11 is fixed; the air bearing 14 slidably supports the movable plate 13. One end (in the figure, the top end) 13a; the holder 15 mounted on the other end (in the figure, the bottom end) 13b of the movable plate 13; the air bearing 16, The air bearing 16 slidably supports the holder 15 ; the vibrating body 17 connected to the holder 15 , and the like.

[0028] The flexible printed circuit board 11 that is bent and fixed between ...

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PUM

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Abstract

The object of the present invention is to provide a high-speed bending test device in which the sliding resistance of the movable plate vibrating at a high speed according to the required stroke is reduced, vibration is eliminated, the durability of the test device itself is improved, and the function of the test device can be adjusted accurately and easily. The mounting posture and mounting position of the flexible printed circuit board of the test piece. A high-speed bending test device (10), wherein one end of a bent flexible printed circuit board (11) is fixed on a fixed plate (12), and a movable plate arranged in parallel at a predetermined distance is placed on the fixed plate (12). (13) fix the other end of the flexible printed circuit board (11), and make the movable plate (13) vibrate at a high speed in parallel with the fixed plate (12), and support the movable plate (13) slidably through the air bearing (14) One end of the movable plate (13) is mounted with a retainer (15), connected to the vibrating body (17), and supports the retainer (15) slidably through an air bearing (16).

Description

technical field [0001] The present invention relates to a high-speed bending test apparatus for performing an IPC bending test of a flexible printed circuit board. Background technique [0002] As a bending test of a flexible printed circuit board, there is known an IPC bending test performed while shifting the bending portion. Flexible printed circuit boards for optical pickups, etc., must be 8 The number of bending times or more is tested. However, this requires a long time, and there is a problem that the life and the number of bendings, which are determined by wear of the operating system of the test apparatus itself, increase, that is, inversely proportional to the increase in speed, and the life is shortened. [0003] Therefore, a high-speed bending test apparatus that operates (vibrates) at a high speed according to a required stroke and also considers the durability of the test apparatus itself is necessary, and various proposals have been made in the past. For ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/36G01M19/00G01M99/00
Inventor 外山敬三长谷川实柳泽直树
Owner NIPPON MEKTRON LTD
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