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Smart card preparing technique

A preparation process and technology for smart cards, which are applied to record carriers, instruments, computer parts, etc. used in machines, can solve the problems of lowering the yield of smart cards and increasing production costs, and achieve easy quality control, lower production costs, and save manufacturing costs. Effect

Inactive Publication Date: 2008-05-21
中电智能卡有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It not only reduces the yield rate of the entire smart card production, but also relatively increases the production cost a lot

Method used

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Examples

Experimental program
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Embodiment Construction

[0022] As shown in Figure 2, the present invention specifically includes:

[0023] Step 1: Firstly, print patterns on the upper surface of the upper substrate and the lower surface of the lower substrate, which is the same as the conventional process;

[0024] Step 2: As shown in Figure 3, the upper substrate 1 is punched out with an outer hole 4 that is equivalent to the size of the outer tank, and the middle substrate 2 is punched out with an inner hole 5 that is equivalent to the size of the inner tank. The position of the outer hole 4 is the same as The position of the inner hole 5 is adapted to ensure that the centers of the outer hole and the inner hole coincide in the subsequent lamination process;

[0025] Step 3: As shown in Figures 4 and 5, stack the stamped upper and middle substrates 1 and 2 with the lower substrate 4, and laminate them to form a large card base 6;

[0026] Step 4: As shown in FIG. 6 , punch the laminated large card base 6 into a small card base 7...

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Abstract

The invention discloses a smart card preparation process, comprising the steps of: 1) punching out an outer hole with a size equal to that of the outer groove on the upper base material, and punching out an inner hole with a size equal to the inner groove on the middle base material, and the position of the outer hole Adapt to the position of the inner hole; 2) Stack the stamped upper and middle base materials with the lower base material and laminate them to make a large card base; 3) Punch the laminated large card base Cut into a small card base, and then implant the integrated circuit module into the hole of the punched small card base. The invention cancels the process step of milling grooves, not only has more operability than the process of milling grooves, greatly improves production efficiency, but also can greatly improve product quality and reduce production costs.

Description

technical field [0001] The invention relates to a production process of a smart card. Background technique [0002] At present, the application of smart cards is becoming more and more common, not only in communication and transportation, but also in enterprises, banks, schools, taxation, public security, medical care, catering, hotels and entertainment, scientific research, books, museums, tourism, customs, etc. aspect. Therefore, the demand for smart cards is also increasing year by year. At present, there is an annual demand of nearly 2 billion smart cards in China alone. [0003] The existing smart card production process is mainly to make a small smart card by performing a series of treatments on several layers of card bases. The specific process steps are shown in Figure 1: first, the upper surface of the upper substrate and the lower surface of the lower substrate are printed on the surface; then they are stacked with the substrate of the middle layer for "laminati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
Inventor 胡建溦李磊
Owner 中电智能卡有限责任公司
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