Packaging structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of general products and methods without suitable structures and methods, inconvenience, etc., and achieve material cost saving and improvement Stability and the effect of improving yield rate
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no. 1 example
[0048] Please refer to FIGS. 1A-1F. FIG. 1A shows a schematic diagram of a substrate according to a first embodiment of the present invention; FIG. 1B shows a schematic diagram of an adhesive film provided on the lower surface of the substrate in FIG. 1A; FIG. 1C shows a first chip paste A schematic diagram on the adhesive film of FIG. 1B; FIG. 1D shows a schematic diagram of a cover structure disposed on the substrate of FIG. 1C; FIG. 1E shows a schematic diagram of a second chip connected to the cover structure of FIG. 1D; FIG. 1F A schematic diagram of an encapsulation material layer formed on the substrate of FIG. 1E is shown.
[0049] According to the manufacturing method of the package structure according to the first embodiment of the present invention, a substrate 10 is firstly provided, and the substrate 10 has an opening 10c, as shown in FIG. 1A .
[0050] Secondly, an adhesive film 20 is provided on the lower surface 10b of the substrate 10, and the opening 10c expo...
no. 2 example
[0059] Please refer to FIGS. 3A-3F. FIG. 3A shows a schematic view of a substrate according to a second embodiment of the present invention; FIG. 3B shows a schematic view of a first chip disposed on the substrate of FIG. 3A; FIG. 3C shows a cover structure setting A schematic diagram on the substrate of FIG. 3B; FIG. 3D shows a schematic diagram of a first packaging material layer formed on the substrate of FIG. 3C; FIG. 3E shows a schematic diagram of a second chip configured on the first packaging material layer of FIG. 3D ; FIG. 3F shows a schematic diagram of a second encapsulation material layer formed on the substrate of FIG. 3E .
[0060] According to the manufacturing method of the package structure according to the second embodiment of the present invention, a substrate 110 is firstly provided, as shown in FIG. 3A .
[0061] Next, a first chip 140 is bonded on the substrate 110 by a first adhesive layer 131 , and the first chip 140 and the substrate 110 are bonded by...
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