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Heat radiator thermal resistivity tester and test system and method

A technology of thermal resistance coefficient and test system, applied in the direction of material thermal conductivity, material thermal development, etc., can solve the problems of shortening CPU life, chronic CPU damage, system instability, etc., and achieve the effect of more rational production

Inactive Publication Date: 2008-06-04
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Excessive temperature will cause "electromigration" phenomenon inside the CPU chip, causing chronic damage to the CPU, shortening the life of the CPU, and causing system instability

Method used

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  • Heat radiator thermal resistivity tester and test system and method
  • Heat radiator thermal resistivity tester and test system and method
  • Heat radiator thermal resistivity tester and test system and method

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Embodiment Construction

[0016] As shown in FIG. 1 , it is a system architecture diagram of a preferred embodiment of the radiator thermal resistance test system of the present invention. The system mainly includes a computer 1 and a radiator thermal resistance tester 2 for testing the thermal resistivity of at least one radiator 3 to be tested. The computer 1 mainly includes a host 10 and a display 11 . The computer 1 also includes components such as a keyboard and a mouse, but these components are not shown in FIG. 1 in order to make the description of this preferred embodiment more concise. The host 10 includes a heat sink thermal resistance test program 20, which is mainly used to test the heat sink through the heat sink heat resistance tester 2 to determine whether the heat sink is qualified. In order to realize the basic functions of the computer 1, the host 10 should also include CPU, memory and other necessary hardware or software, which will not be described here. The display 11 provides a ...

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Abstract

The invention provides test method for thermal resistance coefficient of radiator, including the following procedures that: the initialization is set; a radiator thermal resistance coefficient tester is started; within the preset test time, the temperatures on the central position and the edge position of the radiator and the thermal resistance coefficient of the radiator are measured; after the test time is over, whether the temperatures on the central position and the edge position of the radiator are more than corresponding preset values respectively is judged; if the temperatures on the central position and the edge position of the radiator are less than corresponding preset values respectively, whether the thermal resistance coefficient of the radiator is more than a preset value is judged; if the thermal resistance coefficient of the radiator is less than a preset value, the radiator passes the test. The invention also provides a radiator thermal resistance coefficient tester and a test system. Compared with prior art, the radiator thermal resistance coefficient test method and the test system have the advantages of realizing the measurement of the thermal resistance coefficient of the radiator and the collection and analysis of the test data, thereby making the production more reasonable.

Description

technical field [0001] The invention relates to a radiator thermal resistance tester, a test system and a method, in particular to a central processing unit (CPU) radiator thermal resistance tester, a test system and a method. Background technique [0002] The busiest part of the computer is the CPU, and its heat generation is also second to none. From 8086 to Pentium series, the speed is getting faster and faster, and the degree of CPU "fever" is getting higher and higher. Excessive temperature will cause "electromigration" phenomenon inside the CPU chip, causing chronic damage to the CPU, shortening the life of the CPU, and causing system instability. [0003] It is generally required that the internal temperature of the CPU should be less than 80°C, and the external temperature should be less than 50°C. So we must take measures to solve the cooling problem of components such as CPU. Especially the temperature of the CPU is directly related to the stability of the entir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20G01N25/18
Inventor 张志勇
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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