Dual heat source radiating module

Abstract

A double-heat source thermal module dissipates the heat generated from a first heating element and a second heating element, and comprises a first heat conducting pipe, a heat dissipating element, a heat pipe which is respectively connected with the first heat conducting pipe and the heat dissipating element, a second heat conducting plate which is formed by the extension of the heat dissipating element; wherein, the first heat conducting pipe and the second heat conducting pipe contact the first heating element and the second heating element respectively to conduct the heat of the two heating elements; the first heat conducting plate conducts the heat to the heat dissipating element through the heat pipe; since the second heat conducting plate is formed by the extension of the heat dissipating element, the heat can be directly conducted to the heat dissipating element, thereby reducing the configuration length of the heat pipe, rapidly concentrating the heat to the heat dissipating element to dissipate the heat and effectively reducing the configuration space of the thermal module.

Description

technical field [0001] The invention relates to a cooling module structure, in particular to a dual heat source cooling module structure. Background technique [0002] Commonly used heat dissipation modules installed in computers are generally designed to dissipate heat for the Central Processing Unit (CPU) that generates the most heat. Usually, the CPU heat dissipation module has a CPU heat sink, a heat pipe, and a set of heat dissipation fins. , the CPU heat sink is pasted on the central processing unit and connected to the cooling fins by the heat pipe, so that the heat generated by the central processing unit is conducted to the cooling fins through the heat pipe to dissipate the heat, but as far as the North Bridge chip (North Bridge Chip) heat dissipation mode, most of the time, only a chip (Chip) heat sink is attached to the north bridge chip to dissipate the heat generated by the north bridge chip when it is powered on. [0003] However, this cooling method can only...

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Problems solved by technology

[0005] However, adding heat pipes or extending the length of heat pipes will increase the configuration space of the overall heat dissipation module, and the configuration of heat pipes will also increase the design cost of the heat dissipation module. In addition, although the configuration of heat pipes can increase heat dissipation performance, with the increase in configuration space, The air flow space will also be limited, making it difficult to dissipate heat, so that the heat dissipation performance cannot achieve the expected effect, or the temperature of the configuration space will rise due to the addition of components

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