Heat radiator

Abstract

The invention provides a heat-sink used for dissipating the heat of the heating elements, which consists of a heat conducting structure and a radiating structure. Wherein the heating elements are connected with the radiating structure through the heat conducting structure; the heat conducting structure is divided into a main part jointing the radiating structure and a connection part jointing the heating elements; the adjoining planes of the main part and the connection part are connected together in a separable manner; furthermore the engaging plane of the main part and the connection part are mutually separated when the environment temperature is under the predetermined valve.On the premise of ensuring the radiation function of the heat-sink, the invention prevents the heat needed by the heating elements from being dissipated by the heat-sink when the heating elements are booted under low temperature, and therefore the heating elements can be started up or run normally; the invention is especially suitable for notebook computer.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device which can automatically adapt to stop heat dissipation under low temperature conditions and ensure normal startup and operation of components to be radiated. Background technique [0002] In the existing computer technology, the problem considered by the heat dissipation device is usually how to improve the heat dissipation efficiency, without considering the minimum operating temperature required by the components to be dissipated in a low temperature environment. For example, the cooling device commonly used in notebook computers includes a heat conduction structure and a heat dissipation structure. One end of the heat conduction structure is in contact with the computer chipset and the central processing unit CPU (hereinafter referred to as CPU), and the other end is connected with the heat dissipation structure. The fan is arranged correspondingly to the ...

AI Technical Summary

Problems solved by technology

However, while improving the heat dissipation efficiency of the cooling device, there is still such a problem: in a low-temperature environment, for example, at -20°C, the problem of starting and running the computer is lower than the minimum temperature required for the computer to start and run.

For example, since the currently commonly used INTEL chips have an operating temperature as low as 0°C, in a general low-temperature environment, after the computer is turned on, it can rely on the chipset and CPU to generate heat to achieve the required operating temperature, but in the first few tens of seconds after starting the computer Inside, it is usually the process of BIOS running and starting the OS. During this period, when the temperature is too low, the cooling speed of the cooling device may be higher than the heating speed of the chip and CPU itself, so that the chipset and CPU can reach the required operating temperature. The time is extended and causes the chipset and CPU to fail to work normally, resulting in failure to boot or operate normally

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