Heat radiator

Abstract

The invention provides a heat dissipation device used for arranging a baseplate. The baseplate is provided with a plurality of electronic components; the heat dissipation device comprises a bearing plate which is provided with a first plate body on which the baseplate is fixedly arranged; a second plate body extends upwards by at least one side end of the first plate body; furthermore, the top of the second plate body forms a combination part; the invention also provides a radiator which is provided with a heat conductive plate which is made of metal material and arranged above the baseplate correspondingly; furthermore, one edge of the heat conductive plate is fixedly connected with the combination part of the bearing plate; the bottom surface of the heat conductive plate is respectively contacted with the surfaces of all the electronic components on the baseplate correspondingly; the heat energy which is emitted when the electronic components work is absorbed by the heat conductive plate of the radiator and the heat energy is then transferred to the bearing plate through the combination part and exhausted through the surfaces of the first plate body and the second plate body of the bearing plate. The radiator of the invention can achieve the beneficial effects of convenient assembly, avoiding processing and saving manufacturing cost.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation system for laying out electronic components. Background technique [0002] The operation of electronic components inside all electronic products will generate heat. If the heat is not discharged, the electronic components will be damaged due to overheating. In particular, integrated circuits (integrated circuits) use microelectronics technology to shrink electronic components into a single chip, which is characterized by small size, multiple functions, and easy use. However, relatively, the heat generated during its operation is also relatively high, and at the same time it cannot be discharged naturally by simply relying on air convection. [0003] At present, the way of fixing and dissipating heat for electronic components in the industry is to fix the substrate with a number of electronic components on the upper end on a carrier plate, and arrange a heat sink ab...

AI Technical Summary

Problems solved by technology

[0005] 1. At present, the commonly used carrier board is only used to provide substrate support, and the heat sink is directly fixed on the upper surface of the electronic component. However, since the size of the electronic component will change depending on the product itself, the size of the heat sink must also be changed accordingly. , to ensure that it can be correspondingly fixed on the electronic components, which is very inconvenient

And relatively speaking, the bearing plate only has the function of supporting the substrate, and cannot actively support the radiator, and its functionality is insufficient.

[0006] 2. Since the thickness of each electronic component is different, especially there are usually other components on the substrate that can dissipate heat by themselves, such as resistors and capacitors. It is bound to be affected by the resistors and capacitors on the substrate, and cannot actually contact the electronic components. As a result, when the electronic components are in operation, the heat generated cannot pass through the heat transfer of the radiator to achieve the cooling effect; The location of the components, proper processing of the heat sink to match the electronic components, resulting in construction troubles in assembly

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