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Copper pre-plating conductive pole protecting equipment

A protection device and pre-copper plating technology, applied in circuits, electrical components, electrolysis processes, etc., can solve problems such as reducing the continuity of production lines, reducing production efficiency, and increasing equipment maintenance time, so as to reduce equipment maintenance cycles and improve production efficiency. , The effect of reducing the number of equipment stops

Inactive Publication Date: 2010-06-02
CHINA ELECTRONIC TECH GRP CORP NO 2 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This reduces the continuity of production line work, increases equipment maintenance time, and reduces production efficiency.

Method used

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  • Copper pre-plating conductive pole protecting equipment
  • Copper pre-plating conductive pole protecting equipment
  • Copper pre-plating conductive pole protecting equipment

Examples

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Embodiment Construction

[0010] The present invention is described below in conjunction with accompanying drawing: the pre-plating copper conductive electrode protection device is by increasing dividing plate 10 in volume tank 5, original solution tank is divided into some no-solution zones C1 and has solution zone T1; An overflow hole and an overflow channel are opened under the area C1, and an overflow channel is provided on the bottom and side of the entire volume tank. Therefore, the upper and lower transmission shafts 1 and 3 in the transmission part A2 are changed from the original solution environment to the current solution-free zone C1 environment. The pumping transmission shaft 7, the anode plate 11, and the anode conductive rod 6 are still placed in the solution zone T1. The cathode conductive block 4 is in contact with the conductive sleeve on the upper transmission shaft 3 , and the cathode conductive block 4 is connected to the lead rod 9 through the conductive connecting frame 8 . The ...

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Abstract

The invention relates to a protection device for pre-plated copper electrodes, solving the problem that the conductive cathode is easy to produce non-compact copper crystal layer in an electroplatingbath and avoiding the material jamming of an electroplating piece or a lead frame in the course of transportation. A volume trough (5) is provided with a clapboard (10), thus improving the technological structure of the trough body and preventing the conductive cathode from contacting the electroplating solution. The device solves the problem that the conductive cathode is easy to produce non-compact copper crystal layer, avoids the material jamming of the lead frame in the course of transportation, increases the production efficiency of the installed equipment and reduces the maintenance cycle of the equipment.

Description

technical field [0001] The invention relates to a continuous copper plating equipment for the lead frame of an integrated circuit, in particular to a protection device for the conductive cathode of an electroplating bath. Background technique [0002] At present, in the continuous copper plating equipment for the lead frame of the integrated circuit, the cathode electrode is generally directly immersed in the electrolyte, and this electroplating method is easy to produce a non-dense copper crystal layer, because this electroplating method is very It is easy to produce copper crystals on the conductive cathode. The copper crystals themselves are monovalent copper ions. After falling into the plating solution, monovalent copper ions will be generated quickly to form copper powder, causing quality problems such as rough copper plating. At the same time, the thickening of the copper layer on the conductive part will also reduce the gap between the transmission roller and the con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D7/00H01L21/445
Inventor 赵晓明景璀高德平曹国斌郑剑峰靳志强王磊周晓军胡剑
Owner CHINA ELECTRONIC TECH GRP CORP NO 2 RES INST