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Glass dam structures for imaging devices chip scale package

An oxide semiconductor, chip-level packaging technology, applied in semiconductor devices, semiconductor/solid-state device components, electrical solid-state devices, etc., can solve problems that limit the design and practicability of future optoelectronic products, increase process stability, reduce Process steps, the effect of improving yield

Inactive Publication Date: 2008-08-20
VISERA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the thickness of the packaging structure increases, it will further limit the design and practicality of future optoelectronic products (mobile phones or personal digital assistants)

Method used

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  • Glass dam structures for imaging devices chip scale package
  • Glass dam structures for imaging devices chip scale package
  • Glass dam structures for imaging devices chip scale package

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Experimental program
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Embodiment Construction

[0032] Hereinafter, please refer to the accompanying drawings showing preferred embodiments of the image display system according to the present invention.

[0033] Please refer to Figure 3a-Figure 3m , which are a series of cross-sectional schematic diagrams showing a preferred embodiment of the manufacturing method of the CMOS image sensor chip-scale packaging structure of the present invention.

[0034] First, please refer to Figure 3a , providing a glass substrate 100 . Next, please refer to Figure 3b , performing integral microfabrication on the glass substrate 100 to form a glass package cover 150 having an opening 102 and a dike structure 101 , wherein the dike structure 101 surrounds the opening 102 . Please refer to Figure 4 , is a schematic diagram of the glass package cover 150, in addition, Figure 3b for Figure 4 Sectional view along the dotted line B-B'. It can be seen from the figure that the section of the side wall 104 of the embankment structure 1...

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PUM

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Abstract

The invention relates to an optoelectronic device chip scale packages and a CMOS image sensor chip scale package. The optoelectronic device chip scale package comprises a substrate configured as a support structure for the chip scale package. A semiconductor die with die circuitry is attached to the substrate. A glass encapsulant is disposed on the substrate encapsulating the semiconductor die, wherein the glass encapsulant has a dam structure around an opening. A seal layer is disposed between the substrate and the dam structure bonding the two together. The invention can reduce processing steps and manufacturing cost and process complexity and increase the yield, in addition reduce the package structure size and increase the technics stability.

Description

technical field [0001] The invention relates to a chip level package of an optoelectronic device, in particular to a chip level package of a CMOS image sensor. Background technique [0002] Microelectronic imaging devices are widely used in digital video cameras (cameras), wireless devices with image storage capabilities, or other applications. For example, mobile phones or personal digital assistants (PDAs) with microelectronic imaging capabilities can be used to capture or transmit digital images. With the development of image display devices with high image quality and small size, the market demand for electronic devices with microelectronic imaging elements is also steadily increasing. [0003] Image sensors included in microelectronic imaging devices can generally be classified into charge-coupled device (CCD) systems or complementary metal-oxide-semiconductor (CMOS) systems. Image sensors of charge-coupled devices are widely used in digital cameras, and complementary...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/02H01L23/04H01L23/10
CPCH01L27/14618H01L27/14683H01L2224/0554H01L2224/05548H01L2224/05573H01L2224/13H01L2924/00014H01L2924/16235H01L2224/05599H01L2224/0555H01L2224/0556
Inventor 李孝文翁瑞坪
Owner VISERA TECH CO LTD