Copper covered aluminum wire forming technique

A copper-clad aluminum wire and forming process technology, applied in metal extrusion dies and other directions, can solve the problems of low production efficiency, affecting the conductivity of copper-clad aluminum wire, poor bonding quality of copper-aluminum interface, etc. The effect of good bonding of aluminum interface and reduction of energy loss

Inactive Publication Date: 2008-08-27
YANSHAN UNIV
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The forming process of the cladding welding method is likely to cause poor bonding quality between the copper-aluminum interface, thereby affecting the electrical conductivity of the copper-clad aluminum wire; the hydrostatic extrusion method requires a special equipment hydrostatic extrusion machine, and the production efficiency is relatively low

Method used

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  • Copper covered aluminum wire forming technique
  • Copper covered aluminum wire forming technique
  • Copper covered aluminum wire forming technique

Examples

Experimental program
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Embodiment Construction

[0020] a. Process the copper tube into a copper tube with an outer diameter of Φ100, an inner diameter of Φ90, and a rectangular rib on the inner wall (see figure 2 ), the rib height is 5mm, and the width is 10mm.

[0021] b. Heat the copper tube to 250°C, and use a low-pressure casting process to die-cast aluminum liquid into the copper tube, and the die-casting temperature is 700°C.

[0022] c. After the copper pipe is cooled to 200°C, put it into the mold of the extrusion machine and extrude it. The extrusion ratio is 10:1, and extrude the copper-clad aluminum wire.

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Abstract

The invention discloses a copper-clad aluminum wire forming process, which is characterized in that the process comprises the following steps of: (1) pre-forming clad copper material into a copper pipe with uniform wall thickness according to the shape and size of an extrusion mold; (2) pre-heating the copper pipe to 200 to 350 DEG C, and die-casting aluminum solution in the copper pipe by low-pressure casting or pressure casting process at a die-casting temperature of 470 to 750 DEG C; and (3) directly carrying out extrusion by an extruder when the metal solution is solidified at an extrusion ratio of (5:1) to (20:1) to obtain the copper-clad aluminum wire meeting the size requirement. The copper pipe may be (a) a common copper pipe; (b) a copper pipe with rectangular ribs on the inner wall; (c) a reticular copper pipe having a cross section shape with fan-shaped holes; (d) a copper pipe with dovetail grooves on the inner wall; (e) a copper pipe with T-shaped groove on the inner wall; and (f) a copper pipe with helical ribs on the inner wall. The novel copper-clad aluminum wire forming process solves the problem that the copper-clad aluminum wire interface is unlikely to be firmly bonded, and the copper-clad aluminum wire achieves better interface metallurgic bonding and has better conductive performance.

Description

technical field [0001] The invention relates to a forming processing method of a copper-clad aluminum wire, in particular, the interface of the formed copper-clad aluminum wire has excellent solid-phase metallurgical bonding performance, so that the copper-clad aluminum wire has excellent electrical conductivity. Background technique [0002] Copper-clad aluminum wire is a "renewal" product of the inner conductor of radio frequency coaxial cable. It also has broad application prospects in the fields of communication cables, building cloth wires, lightweight magnet wires and other wire and cable conductors. With the rapid development of the information industry, it has brought important opportunities for the extensive application and development of radio frequency coaxial cables. Copper has good electrical conductivity and strong corrosion resistance. After adding a small amount of tin or silver to copper, its wear resistance and heat resistance may be further improved. For ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C37/04B21C23/00B21C25/02B22D19/00
Inventor 骆俊廷徐岩顾勇飞
Owner YANSHAN UNIV
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