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Composite board for heat sinking and forming method thereof

A composite board and flat panel technology, applied in circuit substrate materials, cooling/ventilation/heating transformation, printed circuit, etc., can solve problems such as difficulty in coping with local heating and unsatisfactory cooling effect

Inactive Publication Date: 2008-08-27
徐达威
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its cooling effect is not very satisfactory, and it is difficult to cope with local heating

Method used

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  • Composite board for heat sinking and forming method thereof
  • Composite board for heat sinking and forming method thereof
  • Composite board for heat sinking and forming method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Below, the present invention will be described in detail with reference to the accompanying drawings.

[0028] Fig. 1, 1a is the composite plate 1 that is formed by two flat plates 101, 102, one surface of which is left blank by grinding or pre-molding method, and then such a plate is passed through a sealing layer such as welding with one surface left empty 105 are connected together to form a plurality of grooves or passages 104 for the heat transfer liquid to flow through. The material of the plate can be P.C., glass, metal, heat-resistant plastic, even marble, and wood (with waterproof treatment in the middle). Because it is combined, it can be called a synthetic board. Corresponding grooves are formed on the opposite sides of the two plates, and when they are engaged, a correspondingly shaped channel 104 is formed through which the cooling liquid can circulate. The cooling liquid can be hydrocarbon oil (such as OPTICOOL's ALPA OIL), water and alcohol mixture or o...

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PUM

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Abstract

The invention proposes a composite plate used for heat emission, and the formation method thereof, wherein the synthesis board comprises at least two flat plates connected together through fusion jointing. The invention is characterized in that a pipeline for heating eliminating liquid to flow is formed between the flat plates, the heating eliminating liquid is controlled by a water pump, and heating electronic parts can be directly or indirectly contacted with the composite plate. A circuit is formed at least one side of the composite plate, and the electronic parts are welded on the circuit. The composite plate solves the heat emission problem of the computer case, the circuit board, and the laptop in particular more effectively, increases the space available and helps air current perform heat emission.

Description

technical field [0001] The invention relates to a synthetic board used for heat dissipation of computers or electrical equipment, in particular, it can be set as a case or container and a circuit board. Background technique [0002] With the advancement of technology, computers or electrical equipment generate more and more heat, so the heat dissipation requirements for equipment are also getting higher and higher. Today's computer central processing unit (CPU) and graphics processing unit (GPU) generate more and more heat. For example, opteron consumes 89W, Prescott and Xeon consume more than 103W, and graphics processors NV40 and R420 consume more than 100W. If the CPU and NV40 are used, the overall power consumption of the computer will be greater than 300W-350W. In addition, the opteron design is very convenient for 4-CPU to 8-CPU integration in a single body. The existing heat dissipation method is generally based on the existing water cooling heat dissipation method, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K1/03G06F1/20
CPCH01L23/473H05K1/0272H05K1/053H05K1/056H05K7/20254H05K2201/064H01L2924/0002G06F1/20G06F2200/201H01L2924/00
Inventor 徐达威
Owner 徐达威
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