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Electronic circuit connection structure and its manufacturing method

A technology for connecting structures and electronic circuits, applied in conductive connections, electrical component connections, circuits, etc., can solve problems such as difficulty in forming circuit filters, complicated manufacturing processes for interference filters, and low yields

Inactive Publication Date: 2008-08-27
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the capacitor element is only electrically inserted between the connector and the circuit board, it is difficult to form a filter of the frequency required by the circuit configuration.
[0012] Also, in order to form a chip-type interference filter, components such as capacitors and resistors are formed on the same surface in advance to form a circuit. The manufacturing process of the chip-shaped interference filter is complicated, and it is easy to cause problems caused by low yields. rising cost of

Method used

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  • Electronic circuit connection structure and its manufacturing method
  • Electronic circuit connection structure and its manufacturing method
  • Electronic circuit connection structure and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0122] 1A is a cross-sectional view of a laminated electronic circuit connection structure according to a first embodiment of the present invention, and FIG. 1B is a diagram showing a circuit configuration of a filter circuit in a connector connection portion. 2A to 2C are diagrams showing the first circuit board 10, the first sheet substrate 15, and the male connector 25, respectively, and FIG. 2D is a cross-sectional view showing a configuration for connecting these. 3 is a plan view showing a state in which the first sheet substrate 15 is fixed to the surface of the male connector 25 that faces the first circuit board 10 . 4A to 4C are cross-sectional views showing the configuration of the second circuit board 30, the second sheet substrate 35, and the female connector 45, respectively, and FIG. 4D is a cross-sectional view showing the configuration of these connections. 5 is a plan view showing a state where the second sheet substrate 35 is fixed to the surface of the fema...

no. 2 approach

[0163] 8A is a cross-sectional view of an electronic circuit connection structure according to a second embodiment of the present invention, and FIGS. 8B and 8C are diagrams showing a filter circuit configuration of a connector connection portion. 9 is a plan view showing a state where the first sheet substrate 50 used in this embodiment is fixed to the surface of the male connector 25 that faces the first circuit board 10 . 10A is a plan view of the first sheet substrate 50 of the present embodiment viewed from the surface side on which the first passive element, that is, the resistive element is formed, and FIG. A top view of the dorsal side view.

[0164] Hereinafter, the electronic circuit connection structure of this embodiment is demonstrated using FIG. 8A to FIG. 10B. In addition, in this embodiment, the case where the first passive element is composed of a resistive element and an inductive element, the second passive element is composed of a capacitive element, and t...

no. 3 approach

[0176] 11A to 12D are diagrams for explaining the configuration of the electronic circuit connection structure according to the third embodiment of the present invention. FIG. 11A is a plan view of a sheet substrate 100 used in the electronic circuit connection structure, and FIG. 11B is a cross-sectional view taken along line 11B-11B of FIG. 11A . 12A is a cross-sectional view when the first wiring board 110 and the second wiring board 114 are arranged on the lower base 118 for fixing, FIG. 12B is a plan view thereof, and FIG. 12D is an equivalent circuit diagram of a state in which an electronic circuit connection structure is manufactured by fixing and electrically and mechanically connecting with the upper base for fixing 120 . In addition, FIG. 12A shows a cross-sectional view taken along line 12A-12A shown in FIG. 12B.

[0177] As shown in FIG. 12C , the electronic circuit connection structure of this embodiment includes: a first wiring board 110 having first connection...

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Abstract

A first sheet-shaped substrate (15) is arranged in a region surrounded by a first terminal of a male connector (25) and a first circuit substrate (10). A second sheet-shaped substrate (35) is arranged in a region surrounded by a second terminal of a female connector (45) and a second circuit substrate (30). By bringing the male connector (25) into abutment with the female connector (45), a first passive element of the first sheet-shaped substrate (15) and a second passive element of the second sheet-shaped substrate (35) constitute a filter circuit.

Description

technical field [0001] The present invention relates to an electronic circuit connection structure for connecting circuit boards, in particular, a laminated electronic circuit connection structure in which sheet-shaped filter circuits are integrated, and a method for manufacturing the same. Background technique [0002] In many electronic devices, electronic components are surface-mounted on various circuit substrates such as printed circuit boards. A filter circuit composed of passive components such as capacitive components, inductors, and resistors. [0003] Currently, a circuit configuration in which one electrode terminal of a chip capacitor element is connected to a terminal pin and the other electrode terminal is grounded is used on the same plane as a circuit board on which electronic components are mounted. However, in such a configuration, an area for mounting the chip capacitive element is required around the electronic component, and thus the mounting density of...

Claims

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Application Information

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IPC IPC(8): H05K1/16H01G4/12H01G4/33H01R11/01
Inventor 山本宪一末次大辅光明寺大道今中崇久村博隆
Owner PANASONIC CORP