Defect mending apparatus and target material structure

Abstract

The present invention provides a defect mending device which comprises the following components: an electromagnetic wave transmitting unit, a platform, a bearing unit and a fluid cooling unit. The platform provides a substrate which is to be mended and has a defect circuit. The bearing unit is arranged between the electromagnetic wave transmitting unit and the platform. The bearing unit bears a mending material which can receive the electromagnetic wave beam provided by the electromagnetic wave transmitting unit to transfer to the defect circuit. The fluid cooling unit absorbs the heat generated in transferring the mending material in order to provide cooling. The problem that the defect mending device is damaged under the hot effect and the oxidation of the mending material because of being heated can be prevented with the device according to the invention. Furthermore, the invention provides a target material structure which bears a plurality of mending material with different materials and different thicknesses in order to adapt for various multiple-mode mending patterns.

Description

technical field [0001] The present invention relates to a repairing device, in particular to a defect repairing device that utilizes fluid cooling to prevent components of the device and repairing materials from being damaged and oxidized by heat. Background technique [0002] Flat Panel Display (FPD) is already one of the most important industries in China. With the development of large-size LCD panels and mass production to the seventh-generation factory, the trend of increasing panel size and increasing demand for production capacity and market demand Under the circumstances, the existing repair process faces a huge bottleneck. As shown in Figure 1, the front-end process of flat-panel displays mainly uses photoresist etching technology to form circuit patterns. In this process, due to pollution and etching errors, open defects (open defects) will occur in circuit patterns after the process is completed. ) 10 and line defects (line defect) 11, these defects are not allowe...

AI Technical Summary

Problems solved by technology

In this technology, after the repaired circuit material is irradiated by laser, the repaired material is easily affected by the energy of the laser to produce a heat-affected zone phenomenon, so there will be problems of material oxidation and destruction

In addition, in the prior art, related components of the device, such as the repairing material carrying unit and the repaired substrate, are easily damaged due to high heat

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