High power LED bracket as well as high power LED made by the same

Abstract

The invention discloses a high power LED bracket and a high power LED manufactured with the bracket; the main components comprises thermal sink, a thermal sink adhering part, a pipe support part, an electrode part, a connecting part for connecting each part and a plurality of unit, a plastic rubber, a LED chip, and a package rubber, comprising the following steps of adhering the thermal sink on alead bracket to from the thermal sink adhering part through die cutting, packaging the thermal sink, the lead bracket by the plastic rubber and forming a high power LED bracket, and then finishing pipe core installation, gold thread bonding and packaging, cutting and blending connected member to form independent high power LED respectively. The invention pastes the thermal sink to the lead frame directly, which provides a high power LED bracket with high production efficiency, and flexible adjustment of light emitting characteristic, for application of packaging and manufacturing high power LED.

Description

technical field [0001] The invention relates to the field of electronic technology, and more specifically relates to a high-power LED bracket and a high-power LED manufactured by using the bracket. Background technique [0002] In 5 to 10 years, solid-state lighting using light-emitting diodes (LEDs) as new light sources will gradually appear in every corner of the traditional lighting market. In terms of device packaging, the world's major LED manufacturers have successively launched various power LED products. The patent named "SURFACE MOUNTABLE LED PACKAGE" and the patent number "US6274924" applied by Lumileds Company of the United States introduced a high-power LED packaging structure with a heat sink, such as figure 1 As shown, it is characterized in that: on the basis of the PLCC type LED plastic packaging frame 1-1, a cooling block 1-2 is added, and a white or black colloid 1-4 is plastic-sealed on the metal bracket 1-3 to form a cavity and fix the electrode lead wir...

AI Technical Summary

Problems solved by technology

[0004] For example, the patent No. "200410027393.1" applied for the power light-emitting diode and its manufacturing method, and proposed a high-power LED manufacturing method using a special-shaped metal material as a lead frame. The lead frame directly constitutes the heat sink of the high-power LED 3-1 , but the cost of material design change is high. Once the design is finalized, it will be difficult to make changes and cannot adapt to flexible and changeable application requirements.

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