EMS memory heat radiating device

Abstract

The invention provides a memory heat dissipating device which is applied to a memory module. The memory heat dissipating device comprises a first heat dissipating element which contacts the memory module, a first positioning unit which is positioned on the first heat dissipating element and provided with a salient, a second heat dissipating element which is connected with the first heat dissipating element, and a second positioning unit which is positioned on the second heat dissipating element and provided with a groove. The salient is embedded into the groove when the second heat dissipating element is connected with the first heat dissipating element. The first heat dissipating element is connected and positioned on the second heat dissipating element by the connection and positioning type of the dissipating element of the invention; the memory heat dissipating element has the advantages of better heat dissipating effect by the close contact between the first heat dissipating element and the second heat dissipating element, and solving the defects of space occupying in the prior art.

Description

technical field [0001] The invention relates to a memory heat dissipation device, especially a memory heat dissipation device applied to a memory module. Background technique [0002] Random Access Memory (RAM for short) is a component used to temporarily store data in a computer system. Random access memory can be read and written at any time, and the speed of reading and writing is very fast. It is usually used as a temporary data storage medium for operating systems or other running applications. [0003] As the function of the computer system becomes more and more powerful, the access speed of the memory (RAM) is also getting faster and faster. As the times require, the heat energy generated by the memory (RAM) during operation is also increasing, and usually the memory (RAM) If the RAM is overheated, it will often cause the computer system to become unstable, and more seriously, it will even directly cause the entire computer system to crash. Therefore, in order to sol...

AI Technical Summary

Problems solved by technology

However, the base body 14 is not in direct contact with the memory module heat sink 10, so the heat dissipation performance is greatly reduced, and because the base body 14 also takes up the space of the mainboard 1001 invisibly, so To install other devices near the base 14 on the motherboard 1001 will often conflict with the base and cannot be installed smoothly.

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