EMS memory heat radiating device

A heat dissipation device and memory technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of seat body conflict installation, heat dissipation performance discount, occupation, etc., to solve the problem of occupying space and good heat dissipation effect Effect

Active Publication Date: 2008-10-15
ASUSTEK COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the base body 14 is not in direct contact with the memory module heat sink 10, so the heat dissipation performance is greatly reduced, and because the base body 14 also takes

Method used

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  • EMS memory heat radiating device
  • EMS memory heat radiating device
  • EMS memory heat radiating device

Examples

Experimental program
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Example Embodiment

[0014] Please refer to FIG. 2(a), FIG. 2(b), FIG. 2(c), and FIG. 2(d), which are schematic diagrams of a first preferred embodiment of a memory heat sink provided by the present invention. As shown in Figure 2(a), the memory module heat sink 2 of the present invention is used on a memory module 200. In the description of this embodiment, in order to more clearly illustrate the technical means used in the present invention, we use Take four memory modules as an example. The memory module heat dissipation device 2 of the present invention includes heat dissipation elements 20, 21 and positioning units 22, 23, wherein the heat dissipation element 21 and the heat dissipation element 20 are connected to each other, and the positioning unit 22 is integrally formed on the heat dissipation element 20 and has at least One protrusion 220 (three protrusions in the figure). In addition, the positioning unit 23 is located on the heat dissipation element 21 and has at least one groove 230 (thre...

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Abstract

The invention provides a memory heat dissipating device which is applied to a memory module. The memory heat dissipating device comprises a first heat dissipating element which contacts the memory module, a first positioning unit which is positioned on the first heat dissipating element and provided with a salient, a second heat dissipating element which is connected with the first heat dissipating element, and a second positioning unit which is positioned on the second heat dissipating element and provided with a groove. The salient is embedded into the groove when the second heat dissipating element is connected with the first heat dissipating element. The first heat dissipating element is connected and positioned on the second heat dissipating element by the connection and positioning type of the dissipating element of the invention; the memory heat dissipating element has the advantages of better heat dissipating effect by the close contact between the first heat dissipating element and the second heat dissipating element, and solving the defects of space occupying in the prior art.

Description

technical field [0001] The invention relates to a memory heat dissipation device, especially a memory heat dissipation device applied to a memory module. Background technique [0002] Random Access Memory (RAM for short) is a component used to temporarily store data in a computer system. Random access memory can be read and written at any time, and the speed of reading and writing is very fast. It is usually used as a temporary data storage medium for operating systems or other running applications. [0003] As the function of the computer system becomes more and more powerful, the access speed of the memory (RAM) is also getting faster and faster. As the times require, the heat energy generated by the memory (RAM) during operation is also increasing, and usually the memory (RAM) If the RAM is overheated, it will often cause the computer system to become unstable, and more seriously, it will even directly cause the entire computer system to crash. Therefore, in order to sol...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 周佳兴蔡志伟卢佳宏
Owner ASUSTEK COMPUTER INC
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