Manufacturing method for heat radiating base of surface adhesive diode support and construction thereof

Abstract

The invention relates to a method for producing a radiating base of a surface-mount diode bracket and structure thereof, and provides a radiating base which can produce various different sizes and thicknesses; the radiating base structure of the diode bracket comprises a colloid, a radiating base connected with the colloid fixedly and a plurality of metal pins connected with the colloid fixedly; the radiating base is provided with a first metal plate and a second metal plate which are mutually stacked and combined in sequence; therefore, the radiating base which consists of the first metal plate and the second metal plate mutually stacked and combined in sequence can produce various different sizes and thicknesses according to the actual requirements so as to provide the diode bracket which can produce various sizes in an adjustable way, thus improving the convenience of producing process, etc. aspects.

Description

technical field [0001] The present invention relates to the design of a light-emitting diode bracket, in particular to a manufacturing method and structure of a heat dissipation base related to a surface-mounted (SMD) diode bracket. The heat dissipation base is formed by stacking and combining, and then has adjustability Producing cooling bases of various sizes and thicknesses efficiently. Background technique [0002] Light Emitting Diode (LED) is a light-emitting component made of semiconductor materials, with a lifespan of more than 100,000 hours, small size, low power consumption, no need for idling time, fast response, Excellent mechanical properties such as shock resistance and mass production. Especially in recent years, the luminous efficiency of light-emitting diodes has been continuously improved, making light-emitting diodes more and more widely used in the field of application, and has gradually been widely used in light sources such as information products. ...

AI Technical Summary

Problems solved by technology

[0008] The above-mentioned heat sink 213 is made by stamping, but its thickness is limited by the thickness of the original substrate 21. It can only be made with a single-size thickness, and can only be used for a single-size diode holder. When the diode bracket changes to a large size, the heat sink 213 must be changed to a thicker size for matching use, or the thickness of the heat sink 213 needs to be increased to achieve a better heat dissipation effect, but the structural design of the heat sink 213 However, it cannot be changed to a thicker size according to the requirements, or an additional appropriate thickness can be provided. It is necessary to make changes to the size of the original substrate 21 before making a thicker heat sink 213. Reaching this requirement is undoubtedly a big problem for diode bracket manufacturers, who cannot flexibly respond to the actual process and product size requirements, thus increasing the inconvenience of the process.

Images