48results about How to "Increase thickness dimension" patented technology

In a multilayer substrate, eight front-side antenna portions and eight back-side antenna portions are disposed. Front-side radiation elements in the front-side antenna portions and back-side radiation elements in the back-side antenna portions are arranged in a staggered pattern when being vertically projected onto an back side of the multilayer substrate. The front-side radiation elements are disposed on a front side of the multilayer substrate, and a front-side ground layer is formed near the back side of the multilayer substrate. On the other hand, the back-side radiation elements are disposed on the back side of the multilayer substrate, and a back-side ground layer is formed near the front side of the multilayer substrate. The front-side radiation element and the back-side radiation element are disposed so as not to overlap each other when being vertically projected onto the back side of the multilayer substrate.

The present invention provides an electronic timepiece with an internal antenna, which can increase the characteristic of antenna without causing the large size of timepiece. An electric wave correcting clock (1) comprises the following components: the antenna which is provided with an elongated magnet core (211) formed by magnet and a coil (212) coiled on the magnetic core (211); a module (10) for containing the antenna (21); and a dial plate (14) which is formed by non-conductive material. Furthermore, an amorphous foil (140) which has a magnetic conductivity larger than that of the dial plate (14) is installed between the dial plate (14) and a module (10) of the electric wave correcting clock (1) in a vertical view for observing the surface orthogonal with the direction from the dial plate (14) to the module (10) at the position that is not overlapped with the coil overlapping area (104) overlapped with the coil winding part (211A) and is overlapped with the guiding overlapping area (105) overlapped with the guiding part (211B).

The embodiment of the invention provides terminal equipment and a shooting method. The terminal equipment comprises a shell, a fixed-focus camera, a driving mechanism and a control unit, wherein the shell is provided with an accommodating cavity; the fixed-focus camera has an accommodating state and a shooting state; the accommodating state is that the fixed-focus camera is accommodated in the accommodating cavity, and the shooting state is that at least part of the structure of the fixed-focus camera extends out of the accommodating cavity to protrude out of the outer end surface of the shell; the fixed-focus camera comprises at least two lens groups, and at least the lens group close to the object plane can move along the optical axis, so that the fixed-focus camera can be switched between an accommodating state and a shooting state; the driving mechanism is in driving connection with the movable lens group; the control unit is electrically connected with the driving mechanism so asto control the driving mechanism to drive the movable lens group to move along the optical axis. According to the terminal equipment, the EFL of the fixed-focus camera can be increased and the thickness of the Sensor can be increased while the lightening and thinning requirements are met, so that the shooting quality of the fixed-focus camera can be greatly improved.

The invention provides a slab laser module with wave-front distortion self-correction ability through optimizing thermal management and optical path design. The slab laser module comprises a laser reflection device and a slab medium used as a gain medium. The upper and lower surfaces at the two ends of the slab medium are evanescent-membrane-free areas, and the middle part between the upper and lower surfaces is an evanescent membrane area. Incident laser L1 enters the inside of the slab medium from the evanescent-membrane-free area at one end of the slab medium, is transmitted along the length direction of the slab medium, and goes out from the evanescent-membrane-free area at the other end of the slab medium. The laser reflection device reflects the output incident laser L1 into the slab medium for second transmission, and the incident laser L1 goes out from the incidence end of first transmission. The constraint condition for the point-of-incidence position of second transmission of the incident laser L1 is that the wave-front distortion waveform generated when the incident laser L1 passes through the slab medium for the first time and the wave-front distortion waveform generated when the incident laser L1 passes through the slab medium for the second time are opposite. Thus, output laser featuring no wave-front distortion, high power and high beam quality is obtained.

The invention provides a method for manufacturing a nanometer focusing X-ray lens combination, comprising the following steps that: (A) a photoetching mask made of a crome metal material on the glass base is manufactured by the electron-beam lithography technique; (B) the conventional cleaning treatment is done on a silicon substrate; (C) the surface of the silicon substrate processed by the step (B) is applied with a layer of ordinary ultraviolet negative photoresist with a thickness of 1 to 3 micron in a spin way; (D) the photoetching mask manufactured in the step (A) is used; (E) a layer of aluminium metal thin film with a thickness of 100 to 250 nanometers is grown on the photoresist pattern structure; (F) a photoresist film is removed and an aluminium material pattern structure with the same structure as the photoetching mask pattern manufactured in the step (A) is formed; (G) the deep silicon material etch is done to manufacture the silicon material one-dimension nanometer focusing X-ray lens combination.

The invention discloses a circuit allocation switching unit, comprising a circuit allocation adapter and a low-current unit drawer, wherein the circuit allocation adapter comprises a metal shell; the metal shell is internally provided with an incoming line bus and an outgoing line bus; an outgoing line end of the incoming line bus and an outgoing line end of the outgoing line bus pass through a jack of the drawer on a metal shell panel respectively to form a static bus socket; and the low-current unit drawer is provided with a movable plug which is electrically connected with the static bus socket of the circuit allocation adapter in an insertion mode. Only one movable contact exists between the circuit allocation adapter and the low-current unit drawer when the circuit allocation adapter is connected with the low-current unit drawer in an insertion mode, thus the temperature is low, the inserted connection reliability is high and the manufacturing cost is reduced.

The invention relates to a method for producing a radiating base of a surface-mount diode bracket and structure thereof, and provides a radiating base which can produce various different sizes and thicknesses; the radiating base structure of the diode bracket comprises a colloid, a radiating base connected with the colloid fixedly and a plurality of metal pins connected with the colloid fixedly; the radiating base is provided with a first metal plate and a second metal plate which are mutually stacked and combined in sequence; therefore, the radiating base which consists of the first metal plate and the second metal plate mutually stacked and combined in sequence can produce various different sizes and thicknesses according to the actual requirements so as to provide the diode bracket which can produce various sizes in an adjustable way, thus improving the convenience of producing process, etc. aspects.

The present invention discloses a Fe-based amorphous soft magnetic bulk alloy. The Fe-based amorphous soft magnetic bulk alloy has a three dimensional structure which includes a Fe-based amorphous soft magnetic component consisting of FeaCobPcBdSie, wherein a, b, c d and e is the atomic percentage (at %) of each component to meet 76<=a<=80, 1<=b<=4, 9<=c<=11, 3<=d<=5 and 5<=e<=7.

The invention discloses a steel piston forming an inner cooling oil way based on laser welding and a machining method of the steel piston. The steel piston comprise a piston body and an annular sealing plate; a piston head part of the piston body is provided with the inner cooling oil way and a combustion chamber; the inner cooling oil way surrounds the combustion chamber, and the piston head part is further provided with an oil inlet hole and an oil outlet hole which communicate with the inner cooling oil way; an annular opening is formed in the upper end of the inner cooling oil way and located in the top end of the piston head part; the annular sealing plate is embedded in the annular opening and connected and fixed through laser welding, the upper end of the inner cooling oil way is sealed, an inner annular channel is formed by the inner circle of the annular sealing plate and the side wall of the annular opening in a surrounding manner, an outer annular channel is formed by the outer circle of the annular sealing plate and the side wall of the annular opening in a surrounding manner, and the inner annular channel and the outer annular channel are filled with high-temperature-resisting heat isolation rings used for forming a laser welding pool. The method comprises the first step of component machining, the second step of laser welding and assembling, the third step of heat treatment and the fourth step of post machining. The steel piston and the machining method have the beneficial effects of being high in machining cost, good in quality stability and low in machining cost.

As shown in FIG. 3, a poppet 27 is formed by a valve body 19 and a supporting plate 28, to a front surface of which the valve body is firmly fixed and with a rear surface of which a tip surface of a plunger 18 contacts. A cap 29 has: a cylindrical portion 29a which is fitted to an outer circumference of the plunger 18; an inward projecting portion 29b which projects inwardly from this cylindrical portion 29a so as to abut on a surface outer circumferential portion 28a of the supporting plate 28; and an outward projecting portion 29c which projects outwardly from the cylindrical portion 29a so as to be engaged with a spring member. The poppet 27 is press-inserted into the cap 29 in a direction in which the inward projecting portion 29b of the cap 29 and the surface outer circumferential portion 28a of the supporting plate 28 abut on each other, and the cap 29 into which the poppet 27 is press-inserted is press-inserted into the tip portion 18b of the plunger 18, whereby the poppet 27 is assembled in the tip surface 28d of the plunger 18.

A projector, comprising a multiblade fan (762) as an exhaust fan oppositely disposed to an exhaust port (2B) formed in an external case (2), sucking air inside the external case (2), and exhausting the air to the outside through the exhaust port (2B). The multiblade fan (762) is disposed so that the suction surface thereof is positioned along a surface perpendicular to an optical path surface formed by a light source device, light modulators, and projection optical device forming the device body of the projector. Also, the multiblade fan (762) is formed such that an exhaust port (762A) is tilted in the rotating direction of a fan, and exhausts sucked air to the end face of the external case where the exhaust port (2B) is formed at the generally center portion in the thickness direction. Thus, an exhausting efficiency can be increased by efficiently sucking inside air without increasing the rotational speed of the exhaust fan, and the thickness dimension can be reduced.

The invention provides a refrigerator capable of reducing the heat energy intruding into the refrigerator. The refrigerator is provided with a front surface flange (17), a back surface flange (18), an inner case flange (19), and a buffer material (7). The front surface flange (17) is integratedly connected with a front edge of an outer case (1), and is formed by being bent towards an inner side. The back surface flange (18) is integratedly connected with the front surface flange (17), and is formed on a back surface side of the front surface flange (17), and also can be bent together with the front surface flange (17) to form an embedded concave part (18a), then can be extended towards the depth direction of the refrigerator. The inner case flange (19) is integratedly connected with the front edge part of the inner case (2), and can be bent outwards, and then is clamped with the embedded concave part (18a) to fix the outer case (1) and the inner case (2). The buffer material (7) is disposed between the front side of the refrigerator (100) of the vacuum heat insulation material (3) and the back surface flange (18).

The invention provides a resin airbag and the circumferential wall of the airbag is made of sheet-shaped synthetic resin.When inflation gas flows into the airbag, the upper wall portion and the lower wall portion of the airbag expand in a separation mode.The three sides surrounded the expansion area are surrounded with outer peripheries.The upper and lower wall portions are connected with each other in a semi-circular arc shape by the section of the airbag along the thickness direction.A continuous curve shape expanding outwardly is formed when viewed downwardly.In the expansion area, foldingportions are concentrically configured toward the inner side thereof, which are in a curve shape surrounding the outer peripheries in three sides and expanding toward the outer peripheries.Each folding portion is in a V shape with two inclined parts along the section of the airbag in the thickness direction.The two inclined parts extend from the bottom of a recess.When inflation gas flows into the airbag, the width of the opening is enlarged due to the plastic deformation of the folding portions, so that the air bag expands.The wall thickness is set within a predetermined range, so that the turning of the wall toward the outer surface thereof is avoided.

A base tape includes: a plurality of RFID circuit elements each including an IC circuit part for storing information and a loop antenna connected to the IC circuit part; and an adhesive layer, a base film, an adhesive layer, an adhesive layer, and a separation sheet that are arranged so as to sandwich each of the RFID circuit elements from both sides in the thickness direction. The base tape is formed such that the ratio c of the sum of the thickness dimensions of the adhesive layer, base film, adhesive layer, adhesive layer, and separation sheet to the thickness dimension of the RFID circuit element is 0.8≦c≦9.8.

The invention provides a method and device for integrating a kitchen range on a cabinet table top and relates to the technical field related to kitchen utensils. According to the technology, the height of a furnace end and a switch device of the kitchen range is increased by thickness of the cabinet table top, and the position, where the kitchen range is installed, of the cabinet table top, a furnace end hole is formed in the cabinet table top corresponding to the size, the shape and the position of the furnace end, a switch hole is formed in the cabinet table top corresponding to the size, the shape and the position of the switch device, the kitchen range is arranged below the cabinet table top, a furnace end can extend out of the furnace end hole, the switch device extends out of the switch hole, the furnace end and the switch device are fixed on the cabinet table top, so a kitchen range panel is integrated on the cabinet table top, the cabinet table top and the kitchen range panel are combined into one, an installation gap between the kitchen range panel and the cabinet table top is eliminated, cleaning is facilitated, and production and installation cost is low, and maintenance, disassembly and assembly are simple.

A method of forming a semiconductor device is disclosed. An exemplary semiconductor device includes a first semiconductor stack and a second semiconductor stack on a substrate, where each of the first semiconductor stack and the second semiconductor stack includes semiconductor layers stacked upward and separated from each other, a dummy spacer between the first semiconductor stack and the second semiconductor stack, wherein the dummy spacer contacts a first sidewall of each semiconductor layer of the first semiconductor stack and the second semiconductor stack, and a gate structure wraps the second side wall, the upper surface and the lower surface of each semiconductor layer of the first semiconductor stack and the second semiconductor stack.