Preparing method of contact tip composite material of vacuum switch based on dispersed copper

A vacuum switch and composite material technology, applied in the direction of electric switches, contacts, electrical components, etc., can solve the problems of high gas content, difficulty in densification, and strict requirements on contact materials, and achieve good voltage resistance and excellent melting resistance Effect of Solder Adhesion Properties

Inactive Publication Date: 2008-10-22
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main disadvantages of the vacuum switch are: 1) It is difficult to adopt metal/ceramic vacuum brazing technology; 2) The requirements for the contact material are strict
However, there are still some quality problems in the production of Cu-Cr alloys, such as the high gas content in the material, the difficulty in c

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example 1

[0022] The dispersed copper-based vacuum switch contact composite material of this embodiment mainly contains Cu, Cr, Al and O elements, where Al and O exist in the form of the second phase of alumina, and its content: Al 2 O 3 , 0.75wt%; Cr, 25wt%; the balance is Cu.

[0023] The process of preparing the above-mentioned integrally dispersed copper material includes:

[0024] ① Alloy smelting; ② Nitrogen atomization powder; ③ Powder mixing; ④ Cold isostatic pressing; ⑤ Internal oxidation; ⑥ Hot extrusion; ⑦ Cold drawing forming.

[0025] Alloy smelting and nitrogen atomization powder

[0026]The alloy smelting is obtained by smelting the Cu-0.37wt% Al alloy using an atmospheric medium frequency induction melting process, that is, the alloy is smelted in a ZG-0.2 type 200kg medium frequency induction melting furnace (using a graphite crucible). The high-purity cathode copper (purity 99.95%) is first melted, and then heated for 8 minutes to refining. Al is added f...

Example Embodiment

[0037] Example 2

[0038] The dispersed copper-based vacuum switch contact composite material of this embodiment mainly contains Cu, Cr, Al and O elements, where Al and O exist in the form of the second phase of alumina, and its content: Al 2 O 3 , 0.55wt%; Cr, 15wt%; the balance is Cu.

[0039] The process of preparing the above-mentioned integrally dispersed copper material includes:

[0040] ① Alloy smelting; ② Nitrogen atomization powder; ③ Powder mixing; ④ Cold isostatic pressing; ⑤ Internal oxidation; ⑥ Hot extrusion; ⑦ Cold drawing forming.

[0041] Alloy smelting and nitrogen atomization powder

[0042] The alloy smelting is obtained by smelting the Cu-0.25wt% Al alloy using an atmospheric medium frequency induction melting process, that is, the alloy is smelted in a ZG-0.1 type 100kg medium frequency induction melting furnace (using a graphite crucible). The high-purity cathode copper (purity: 99.95%) is first melted, and then heated for 5 minutes for refining. Al is adde...

Example Embodiment

[0053] Example 3

[0054] The dispersed copper-based vacuum switch contact composite material of this embodiment mainly contains Cu, Cr, Al and O elements, where Al and O exist in the form of the second phase of alumina, and its content: Al 2 O 3 , 1.50wt%; Cr, 45wt%; the balance is Cu.

[0055] The process of preparing the above-mentioned integrally dispersed copper material includes:

[0056] ① Alloy smelting; ② Nitrogen atomization powder; ③ Powder mixing; ④ Cold isostatic pressing; ⑤ Internal oxidation; ⑥ Hot extrusion; ⑦ Cold drawing forming.

[0057] Alloy smelting and nitrogen atomization powder

[0058] The said alloy melting is to adopt the Cu-1.0wt% Al alloy by the atmospheric medium frequency induction melting process, and the melting method is the same as that of Example 2. Then the alloy liquid is directly introduced into the nitrogen atomization device for atomization and powder making.

[0059] Mixed powder

[0060] Oxidizer is industrial grade Cu 2 O, particle size...

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Abstract

The invention belongs to the alloy material technical field and provides a preparation technology method for a dispersion copper matrix vacuum switch contact composite material. The method adopts Cu-Al alloy powder with low solid solubility, the aluminum content of the Cu-Al alloy powder is not more than 1.00 wt percent, the balance is Cu, pure chromium metal powder and industrial Cu2O are taken as raw materials, wherein, the mixing proportion of the Cu-Al alloy powder and the oxidant Cu2O is (94-96)wt percent: (6-4)wt percent, and the mixing proportion of the total amount of the Cu-Al alloy powder and the oxidant Cu2O as well as Cr powder is (75-50)wt percent: (25-50)wt percent; the preparation technology comprises alloy melting, powder preparation, powder mixing, pressing, internal oxidation as well as hot extrusion and cold drawing molding; wherein, the inner oxidation and sintering are synchronously carried out, the sintering temperature is between 900 and 1050 DEG C, and the sintering time is between 4 and 10 hours; the obtained dispersion copper matrix vacuum switch contact composite material mainly comprises a dispersion copper matrix Cu-Al2O3 and Cr particles, the content of the Cu-Al2O3 is less than or equal to 1.50 wt percent, the diameters of particles are not more than 100nm, and the Cr content is between 25 and 50 wt percent.

Description

technical field [0001] The invention belongs to the technical field of alloy materials, and mainly relates to a preparation process method of a dispersed copper-based vacuum switch contact composite material. It can be used in fields such as high-power electric vacuum tubes and vacuum breakers, and is widely used in defense industry and power industry. Background technique [0002] The performance of the vacuum switch is closely related to the contact material. The contact material not only affects the withstand voltage strength of the vacuum switch, but also affects the breaking capacity and life of the vacuum switch, and also affects the long-term current carrying capacity of the vacuum switch. The development of any contact material Both will lead to the improvement or improvement of the performance of the vacuum switch. [0003] The key component of the vacuum switch is the vacuum switch tube. The inside of the vacuum switch tube is a closed cavity, and the vacuum degre...

Claims

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Application Information

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IPC IPC(8): H01H11/04H01H1/025C22C9/01C22C1/04
Inventor 田保红刘平刘勇夏承东宋克兴任凤章贾淑果李红霞朱建娟
Owner HENAN UNIV OF SCI & TECH
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