Light emitting device and method of manufacturing the same
A technology of a light-emitting device and a manufacturing method, which can be applied to lighting devices, electroluminescent light sources, light sources, etc., can solve problems such as limitations, and achieve the effect of ensuring strength
Inactive Publication Date: 2008-10-29
ELEMENT DENSHI
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Problems solved by technology
Thinning processes such as improvement of the material of the supporting substrate 200 are also progressing, but a certain level of strength needs to be ensured as a supporting material, and there is no possibility of a substantial thinning when considering the ease of handling in the manufacturing process. limited
Method used
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Effect test
Embodiment Construction
[0066] refer to Figure 1 to Figure 6 Embodiments of the present invention will be described.
[0067] first, figure 1 represents the light-emitting device of the present invention. figure 1 (A) is the above picture, figure 1 (B) is figure 1 (A) The a-a line profile.
[0068] The light-emitting device of this embodiment is composed of an insulating substrate 10, a first conductive foil 11, a second conductive foil 12, a through-hole 25 for element placement, an anchor electrode 12a, a light-emitting element 31, thin metal wires 30, and an extraction electrode 11a.
[0069] The insulating substrate 10 functions as a support substrate for the first and second conductive foils 11, 12, and it is a substrate made of FR4 (epoxy glass cloth), BT (bismaleimide triazine) resin, glass Epoxy substrate, glass polyimide substrate, etc. In this embodiment mode, a substrate made of BT resin is used as an example. The thickness t1 of the insulating substrate 10 is, for example, abo...
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The invention relates to a light producing device and a manufacturing method thereby. The existing light producing device has a structure cascading luminous elements on a bearing substrate, thereby limiting thinning of the light producing device. The light producing device of the invention consists of a first conductive foil arranged on a main surface of an isolated substrate, a second conductive foil arranged on another main surface, a communicating pore used for loading elements which communicates the isolated substrate, the luminous element, a fixation electrode formed by the second conductive foil in a mode of covering the communicating pore used for loading elements, an extraction electrode structured by the first conductive foil, a metal fine line connecting a first electrode and the extraction electrode of the luminous element, and crystalline resin. The luminous elements are arranged in the communicating pore used for loading elements. Luminescence of the luminous element is reflected by a conductibility metal layer arranged on a inclined plane of the communicating pore used for loading elements. The luminous elements are arranged in areas without the isolated substrate, thereby realizing the thinning of the light producing device and guaranteeing the intensity as bearing material via cascading the conductibility metal layer on the fixation electrode.
Description
technical field [0001] The invention relates to a thin light-emitting device inserted into an insulating substrate with conductive foil pasted on both sides and a manufacturing method thereof. Background technique [0002] Figure 7 shows a light-emitting device that prevents the light emitted from the light-emitting element from being absorbed by the support substrate, suppresses loss of light emission, and improves the overall brightness. [0003] This light-emitting device is composed of a light-emitting element 100 , a supporting substrate 200 , a substrate electrode 300 , an anchor electrode portion 400 , a light reflection portion 500 , a hole portion 600 , and a plating layer 700 . The light emitting element 100 is a Group III nitride compound semiconductor light emitting element. The support substrate 200 is an insulating substrate formed of resin such as polyimide, glass epoxy resin, or BT resin, and further has the following parts: a pair of substrates composed of...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05B33/26H05B33/12H01L33/00H01L33/62
CPCH01L2224/16225H01L2224/48227H01L2224/48237H01L2924/181
Inventor 成田悟郎
Owner ELEMENT DENSHI