High power LED lens encapsulation process
A technology of LED lens and packaging technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of bubbles in the lens, and achieve the effect of convenient operation, advanced technology and good light output effect.
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[0007] Apply the present invention to the manufacture of 1W LED light source, fix the luminous wafer after coating and other processes on the support, and then make the luminous wafer support. The lens made by a certain process is convex on one side and concave on the other. The space part of the light-emitting chip holder and the concave surface of the lens are filled with AB glue, and then the injected glue is evacuated, and then the concave side of the lens with AB glue is attached to the light-emitting chip holder, and gradually the concave surface of the lens and the light-emitting chip The opposite sides on the bracket are all pasted together to form a preliminarily packaged high-power LED. Place the convex side of the lens of the preliminarily packaged high-power LED downward on a baking rack, bake in an environment of 130° C. for 1 hour, and obtain a high-power LED light source after cooling. Since the lens is at the bottom during the baking process, even if a small am...
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