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High power LED lens encapsulation process

A technology of LED lens and packaging technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of bubbles in the lens, and achieve the effect of convenient operation, advanced technology and good light output effect.

Inactive Publication Date: 2008-11-19
JIANGSU SUN & MOON LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of air bubbles in the lens packaging process, the invention provides a high-power LED lens packaging process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0007] Apply the present invention to the manufacture of 1W LED light source, fix the luminous wafer after coating and other processes on the support, and then make the luminous wafer support. The lens made by a certain process is convex on one side and concave on the other. The space part of the light-emitting chip holder and the concave surface of the lens are filled with AB glue, and then the injected glue is evacuated, and then the concave side of the lens with AB glue is attached to the light-emitting chip holder, and gradually the concave surface of the lens and the light-emitting chip The opposite sides on the bracket are all pasted together to form a preliminarily packaged high-power LED. Place the convex side of the lens of the preliminarily packaged high-power LED downward on a baking rack, bake in an environment of 130° C. for 1 hour, and obtain a high-power LED light source after cooling. Since the lens is at the bottom during the baking process, even if a small am...

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PUM

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Abstract

The invention relates to high-power LED lens encasing technique. Air bladders exist in encased lenses of LED light sources that are generally known, which affects light emission. The technique of the invention is characterized in that the lens of an initially encased LED is arranged on a baking rack with the convex surface facing downward and is baked under certain temperature for a certain period of time, thus realizing no air bladders in the lens. The technique of the invention is advanced and is convenient to operate and has no air bladders and good light emission.

Description

technical field [0001] The invention relates to a high-power LED lens packaging process, which is suitable for solving the problem of air bubbles in the lens packaging process. Background technique [0002] LED (light-emitting diode, light-EmittingDiodc) is a kind of light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has low operating voltage, low power consumption, high luminous efficiency, short luminous response, pure light color, and firm structure. , impact resistance, stable performance, light weight, small size and other excellent characteristics. It is recognized as the first choice for future light sources. However, the traditional high-power LED lens package is prone to air bubbles, which affect light output. Therefore, it is hoped that a new packaging process that can overcome the above-mentioned shortcomings will come out. Contents of the invention [0003] In order to solve the problem of air bubbles ...

Claims

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Application Information

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IPC IPC(8): H01L33/00
Inventor 徐向阳唐建华
Owner JIANGSU SUN & MOON LIGHTING