Memory cell comprising nickel-cobalt oxide switching element
A storage unit and component technology, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc.
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[0052] Example: Manufacturing
[0053] See Figure 7a , the formation of the memory starts with the substrate 100 . This substrate 100 can be any semiconductor substrate known in the art, such as single crystal silicon, IV-IV compounds like silicon-germanium or silicon-germanium-carbon, III-V compounds, II-VII compounds, such epitaxial layer or any other semiconducting material over these substrates. The substrate may include integrated circuits fabricated therein.
[0054] An insulating layer 102 is formed over the substrate 100 . The insulating layer 102 can be silicon oxide, silicon nitride, high dielectric film, Si-C-O-H film or any other suitable insulating material.
[0055] The first conductor 200 is formed on the substrate 100 and the insulator 102 . An adhesive layer 104 may be included between the insulating layer 102 and the conductive layer 106 to facilitate the adhesion of the conductive layer 106 . A preferred material for the adhesion layer 104 is titanium...
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