Solid-state image pickup device and electronic apparatus including same

Abstract

The invention relates to a solid-state image pickup device and a electronic device with the same. A camera module 1 includes: an optical structure 3 that forms a subject image; a solid-state image pickup element 21 that converts, into an electrical signal, a subject image formed by the optical structure 3; a lens holder 4, holding the optical structure 3 therein, which contains the solid-state image pickup element 21; and a cushioning member 34, disposed between the optical structure 3 and the lens holder 4 so as to avoid an optical path of the optical structure 3, which absorbs the impact of contact between the optical structure 3 and the lens holder 4, the cushioning member being made of nonmetallic material. This makes it possible to provide a small solid-state image pickup device while preventing dust from being generated when the camera module 1 is manufactured or used.

Description

technical field [0001] The present invention relates to a solid-state imaging device capable of preventing dust from adhering to an optical path during manufacture and use. Background of the invention [0002] Camera modules (solid-state imaging devices) used in mobile phones and the like are composed of solid-state imaging elements (CCD (charge-coupled device: charge-coupled device) or CMOS (complementary metal-oxide semiconductor: complementary metal-oxide semiconductor) ) Sensor IC (integrated circuits: integrated circuit)), infrared filter and terminal wiring substrate, lens and lens support are integrated into a module. Recently, in order to cope with the downsizing of camera modules, the miniaturization of the manufacturing process of the solid-state imaging device has progressed. After miniaturization of the camera module, fine dust (for example, 25 μm or more) present on the optical path may cause image defects. The reason for the poor image is that the shadow of d...

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Problems solved by technology

[0013] However, in the conventional structure, there are problems in that the dust countermeasures are not sufficient and the solid-state imaging device cannot be miniaturized.

In this way, in the structure of Patent Document 2, dust adheres to the optical path, causing image defects.

[0018] Moreover, in the structure of Patent Document 2, there is also the following problem: the static electricity used for attracting dust will become the cause of the malfunction of the solid-state imaging device 206; there are some dusts, such as metal dust, which cannot be attracted by static electricity.

Therefore, the solid-state imaging device of Patent Document 3 tends to increase in size

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