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Method for improving prepared thin film thickness in rotary coating method

A thin-film thickness and spin-coating technology, which can be used in photo-engraving process coating equipment, devices for coating liquids on surfaces, coatings, etc.

Inactive Publication Date: 2008-12-17
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the thickness of the PMMA waveguide film needs to reach about 2 μm, and the thickness of the thin film spin-coated with a dilute solution is less than 100 nm each time, which needs to be repeated more than 10 times. The process is cumbersome, the workload is large, and the efficiency is low.

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  • Method for improving prepared thin film thickness in rotary coating method
  • Method for improving prepared thin film thickness in rotary coating method
  • Method for improving prepared thin film thickness in rotary coating method

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0019] Taking the preparation of Love wave waveguide thin film as an example, a method of preparing thin film by spin coating method proposed in this paper is described. The Love wave device is divided into upper and lower layers in structure: the bottom layer is a piezoelectric wafer, the middle layer is an electrode, and the top layer is a waveguide film. The electrodes usually consist of a pair of interdigital transducers (IDTs), which may also contain reflective grids. Such as figure 1 As shown, the PMMA waveguide film will be prepared on the electrode 2, and the thickness of the PMMA waveguide film needs to reach about 2 μm, for which the frame spin coating process of the present invention is adopted.

[0020] A kind of spin coating method provided by the present invention prepares the method for thin film as follows (example):

[0021] Accordin...

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Abstract

The invention discloses a method for improving the thickness of a film prepared in the spincoating. Raised steps 5 Mu m to 500 Mu m high are formed on a coated baseplate through spincoating photoresist or sticking adhesive tapes, thus forming a closed frame. A solution is dropped in the area enclosed by the frame, and a film is prepared through the spincoating. By adopting the method, the thickness of the spincoated film can be significantly improved. The method is applicable for a plurality of fields needing preparation of thick films, and can reduce the frequency of repeated spincoating. The method has the advantages of simple process, strong maneuverability and large application value.

Description

technical field [0001] The invention relates to the technical field of thin film preparation, in particular to a method for increasing the thickness of the prepared thin film in a spin coating method. Background technique [0002] Spin coating method is a commonly used thin film preparation method. It has the characteristics of simple equipment, strong production capacity, large film area and uniform thickness. It is widely used in optical discs, semiconductor devices, electronic components and other fields. [0003] The thickness of the spin-coated film can be adjusted by changing the concentration and viscosity of the spin-coating solution, the type of solvent, the rotational speed and time of spin-coating, and other parameters, and it can also be achieved by multiple spin-coating methods. The most effective way to increase the thickness of the film is to increase the concentration and viscosity of the spin coating solution and to use multiple spin coating methods. Howeve...

Claims

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Application Information

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IPC IPC(8): G03F7/16B05C11/02B05D3/00
Inventor 杜晓松蒋亚东胡佳
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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