Method for simulating hot test chip thermal resistance value

A technology of thermal resistance and thermal testing, which is applied in the direction of measuring devices, material thermal development, instruments, etc., can solve the problems that the heating state and thermal resistance of the thermal test chip cannot be truly displayed, and the heat dissipation quality of the heat dissipation module is difficult to ensure.

Inactive Publication Date: 2008-12-31
INVENTEC CORP
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Problems solved by technology

At the same time, the heating power of the thermal test chip will also increase with the increase of the operating frequency, and factors such as changes in the ambient temperature and contact pressure errors will also directly affect the instability of the test results. When testing the heat dissipation performance of the heat dissipation module, since the heating block used is of a single size, it cannot truly show the heating state and thermal resistance of the thermal test chip, so it is difficult to ensure the heat dissipation quality of the heat dissipation module after mass production

Method used

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  • Method for simulating hot test chip thermal resistance value
  • Method for simulating hot test chip thermal resistance value
  • Method for simulating hot test chip thermal resistance value

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Embodiment Construction

[0021] The method for simulating the thermal resistance of a thermal test chip according to the present invention is mainly applied in a computer mainframe or a server mainframe for evaluating the thermal resistance R of a heating block. heater and the thermal resistance of the thermal test chip R TTV The correlation between them is used as a method to quickly test the heat dissipation performance of the heat dissipation module. Applying this method can not only ensure that the heat dissipation modules produced meet the system design requirements, improve the quality of mass production, but also greatly reduce the sample testing time.

[0022] Since the heating block is a material with uniform heat conduction, and the corresponding relationship between the size of the heating block and its thermal resistance value can be found through the regression analysis theory to find the corresponding function curve to set the thermal resistance value R of the simulated thermal test chip...

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Abstract

The invention discloses a method used for simulating the thermal resistance value of a thermal test chip, evaluating the correlation between the thermal resistance value of a heating block and the thermal resistance value of the thermal test chip and finding the size of the heating block that fits for heat generating situations of actual chips. Furthermore, after implementing the radiating performance test of the heating block, the method also can improve the reliability of test results by validating that whether the relation between a transient response value of the thermal resistance of the heating block and a steady response value of the thermal resistance of the thermal test chip lies in a preset variation range.

Description

technical field [0001] The invention relates to a heat dissipation performance test method, and in particular to a heat dissipation performance test method which uses a heating block to simulate a thermal test chip and find out the size of the heating block. Background technique [0002] In the current computer system, the work performance and frequency of the central processing unit continue to increase, and the heat dissipation problem has become the focus of each design, and the coordination between the heat dissipation performance of the heat dissipation module and the heat density of the central processing unit has begun to be considered. . [0003] When an engineer starts to design a cooling module in a host computer or server, first of all, according to the space planning in the host computer or server (circuit layout, main heating element, hard disk drive, interface card location... etc.) and the heat dissipation effect to be achieved, a set of heat dissipation modu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20G01B21/00
Inventor 王锋谷郑懿伦
Owner INVENTEC CORP
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