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Crown glass composite material with low thermal expansion coefficient

A technology of thermal expansion coefficient and composite material, applied in the field of lead-free glass composition, which can solve problems such as the destruction of solder flow ability

Inactive Publication Date: 2009-01-07
SCHOTT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the amount of filler material added is limited by the unavoidable damage to solder flow capability created by the additional filler material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The following examples were prepared by mixing different amounts of borosilicate glass powder containing (expressed in wt % based on oxide content) 13.5 wt. % B and cordierite powder 2 o 3 , 4.2 wt.% Na 2 O, 2.2wt.%Al 2 o 3 and 78.6wt.% SiO 2 , the composition of cordierite powder (expressed in wt% based on oxide content) is 13.8wt.% MgO, 34.8wt.% Al 2 o 3 , and 51.4wt.% SiO 2 . The particle size d of the powder 50 5±1μm.

[0014] The mixture was heated and the onset temperature of sintering was determined by a heating microscope with automatic image processing. The samples were sintered at about 1100° C. within 3 hours to a substantially non-porous sintered body. Measuring the coefficient of thermal expansion α (20-300) and glass transition temperature Tg. Exemplary glass composites and their properties are reported in Table 1 below.

[0015] Table 1: Glass composites of the present invention and their properties

[0016] Example

[0017] * n.d...

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PUM

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Abstract

The present invention relates to a glass composite material with linear thermal expansion coefficient alpha(20-300) of 1.8*10<-6>K<-1> to 2.4*10<-6>K<-1> and glass transition temperature Tg less than 650 DEG C. The glass composite material comprises the following components in weight percentage based on the content of oxides: 5-9 of B2O3; 1-3 of Na2O; 15-22 of Al2O3; 61-68 of SiO2; 0.2-0.5 of K2O; and 5.5-8.5 of MgO. The glass composite material can be prepared through sintering a mixture of 40-60wt.% of borosilicate glass powder and 60-40wt.% of iolite powder. The powder mixture can be used for preparing a glass solder which is used for connecting component, for preparing a sintered body which has thermal shock, or used for the glazing or braze welding of the PZT ceramic.

Description

Background technique [0001] A subject of the present invention is a lead-free glass composition with a low coefficient of thermal expansion. [0002] Glass composites are known per se. They are primarily used as glass solders for joining applications. They are made of glass powder to which an inert filler material is added to affect the coefficient of thermal expansion. The coefficient of thermal expansion of the solder can be changed or adjusted by means of these filling materials to achieve the thermal expansion coefficient of the metal, glass or ceramic components connected with the glass solder. The solder (ie glass phase) usually crystallizes at higher filler content. In said uncrystallized so-called stable glass solders, the glass content of the solder remains glassy. Typically, the amount of filler material added is limited by the unavoidable damage to solder flow capability produced by the additional filler material. Summary of the invention [0003] The object ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C3/089C03C8/24C03C8/02
CPCC03C2214/16C03C14/006C03C3/091
Inventor 迪特尔·格德克苏珊·基尔迈尔
Owner SCHOTT AG
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