Oxidation resistant low-silver lead-free solder

Abstract

The invention relates to an oxidation resistant low-silver lead-free solder, which comprises the raw materials with the following weight portions of 0.1-1.0 percent of Ag, 0.5-1.0 percent of Cu, 0.001-0.1 percent of Ni, 0.008-0.1 percent of Ge, 0.001-0.1 percent of P and Sn for the rest, and has the advantages and effects of large temperature range in fusion state, good fluidity, low cost, good antioxidation and wettability, and refined grains.

Description

technical field [0001] The invention relates to an oxidation-resistant low-silver lead-free solder, which is a soldering material used for soldering printed boards, and belongs to the field of soldering materials. technical background [0002] At present, the lead-free solders that replace tin-lead solders mainly include Sn-Cu series and Sn-Ag-Cu series lead-free solders, and the representative ones in the Sn-Ag-Cu series lead-free solders are Sn3.5Ag0.7Cu and There are two kinds of Sn3.0Ag0.5Cu. In these two kinds of Sn-Ag-Cu lead-free solders, the silver content is between 3.0 and 3.5%. Since silver is a precious metal, only silver in the above two solders is sufficient. It accounts for more than half of the cost of solder. In order to reduce the cost of solder, some people have developed low-silver lead-free solder, such as patent document CN1544197A, which discloses lead-free solder with a silver content of 2.0-2.9%. Although the silver content is reduced, the silver con...

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Problems solved by technology

[0002] At present, the lead-free solders that replace tin-lead solders mainly include Sn-Cu series and Sn-Ag-Cu series lead-free solders, and the representative ones in the Sn-Ag-Cu series lead-free solders are Sn3.5Ag0.7Cu and There are two kinds of Sn3.0Ag0.5Cu. In these two kinds of Sn-Ag-Cu lead-free solders, the silver content is between 3.0 and 3.5%. Since silver is a precious metal, only silver in the above two solders is sufficient. It accounts for more than half of the cost of solder. In order to reduce the cost of solder, some people have developed low-silver lead-free solder, such as patent document CN1544197A, which discloses lead-free solder with a silver content of 2.0-2.9%. Although the silver content is reduced, the silver content Still very high, CN101036962A patent document discloses another kind of low-silver lead-free solder, the content of silver in this product is 0.01~0.05%, such low silver content has no effect for reducing the melting point of solder

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