High heat conducting shimming material of LED light fitting heat radiation technique

Abstract

The invention relates to a high-thermal conducting gap filling material which is adaptable to the radiating technique for LED lambs. The high-thermal conducting gap filling material utilizes flexible pasty silicone grease as a thermal conducting base material, is added with certain silver nanowires and micron-sized thermal conducting metal particles as a thermal conducting filling material, and utilizes certain surface active agents to synthesize via stirring. The high-thermal conducting gap filling material is used in a gap between a metal radiating base on an LED package support and a copper foil on a corresponding position of an aluminum base, and in a gap between the aluminum base and a radiating structure of a lamp casing. After being treated by a special technique of low-temperaturesintering, the sliver nanowires and the micron-sized thermal conducting metal particles in the flexible gap filling material can be sintered into network connection in a chemical bond type, and formsan sub-integral efficient radiating passage among the LED (the heat source), the aluminum base and the radiating structure of the lamp casing to guarantee the LED to work under an allowable temperature, thereby guaranteeing the high amount of passed light and the super-long service life.

Description

Technical field: [0001] The invention relates to a high thermal conductivity gap filler material for LED lamp heat dissipation technology. Background technique: [0002] Lamps made of semiconductor LEDs will generate considerable heat when they enter the working state, especially when high-power LED lighting sources are used in groups in the actual environment, the heat dissipation technology of the lamps directly affects the luminous efficiency and service life of the LEDs. [0003] In the LED light-emitting monomer structure, in order to solve the heat dissipation problem of the chip itself, a metal heat dissipation base is designed on the package bracket. The power LEDs used in groups are arranged in a certain form of array, and the two pole electrodes of each LED are welded on a special aluminum substrate, and the metal heat dissipation base on the package bracket is in contact with the copper foil at the corresponding position on the aluminum substrate. , The working heat of ...

AI Technical Summary

Problems solved by technology

The disadvantage of this technology is: the thermal conductivity of epoxy resin is poor, and it is affected by the change of ambient temperature after curing, which will easily cause the two to detach and lose the condition of thermal conductivity; the other is to use thermal conductive silicone grease as a contact agent to replace epoxy resin. resin craft

However, the connection between metal particles is a physical connection, which cannot achieve the ideal heat conduction effect.

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