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Epoxy resin composition

A technology of epoxy resin and composition, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc.

Inactive Publication Date: 2011-05-18
SDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this COF process, the problem is that since the gap between the board and the bare chip is less than tens of micrometers, and the existing resins used in the TCP process contain a large amount of inorganic fillers and solvents, they cannot be directly applied to the bottom of the COF Filling process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014]With 70 parts by weight of bisphenol F type epoxy resin (Japan Epoxy Resin Co.Ltd., product name: Epikote YL 983U), 30 parts by weight of monofunctional reactive diluent (Japan Epoxy Resin Co.Ltd., product name: YED-111E), 120 parts by weight of liquid anhydride curing agent (Japan Epoxy ResinCo.Ltd., product name: YH-306), 5 parts by weight of curing accelerator (Ajinomoto Fine TechnoCo.Ltd, product name: MY-24) It was mixed with 2.0 parts by weight of a silane coupling agent (Japan Unikasa, product name: A-187) to prepare a resin composition for liquid encapsulation.

Embodiment 2

[0016] With 70 parts by weight of bisphenol F type epoxy resin (Nippon Kayaku Co.Ltd, product name: RE-303S), 30 parts by weight of multifunctional reactive diluent (ASAHI DENKA CO.LTD., product name: ED-505R ), 130 parts by weight of liquid anhydride curing agent (Japan Epoxy Resin Co.Ltd., product name: YH-307), 2.0 parts by weight of silane coupling agent (GE TOSHIBA SILICONES, product name: A-187) and 5 parts by weight Parts of curing accelerator (FUJI KASEI CO.LTD, product name: FXR-1020) were mixed to prepare a resin composition for liquid encapsulation.

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Abstract

The present invention relates to an epoxy resin composition, in particular, to an epoxy resin composition suitable for use as an encapsulation agent for electrical parts such as drive- ICs mounted on a circuit board. The epoxy composition is a liquid phase at room temperature and includes 100 parts by weight of an epoxy resin having 2 or more glycidyl groups in the molecure, 10-50 parts by weightof a reactive diluent having one or more glycidyl groups in the molecure, 50-200 parts by weight of an anhydrous curing agent which is a liquid phase at room temperature with respect to 100 parts by weight of the epoxy resin and the reactive diluent, and 1-20 parts by weight of a latent curing accelerator with respect to 100 parts by weight of the epoxy resin, the reactive diluent, and the anhydrous curing agent, and whose viscosity at 25 DEG C is 250-500cps, gelation time at 150 DEG C is below 120 seconds.

Description

technical field [0001] The present invention relates to an epoxy resin composition, and in particular, to an epoxy resin composition suitable as a sealing material for electronic components including driver-ICs mounted on circuit boards things. Background technique [0002] Currently, flat panel displays including liquid crystal displays (LCD), plasma displays, and electroluminescent devices (EL) have been It is used as a main image display device, and driver integrated circuits (driver-ICs) that drive these electronic components also need to be miniaturized. A series of steps for mounting bare chips such as driver-ICs on a circuit board is called packaging. Regarding the packaging method, a tape carrier package (TCP) process has been used in the past, which involves forming a circuit on a polyimide film, mounting a bare chip, flipping the bare chip down, and attaching it to a circuit board. Fill the hole with resin. [0003] However, the disadvantage of the TCP method i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02
CPCH05K3/285C08G59/42C08G59/686C08K5/00C08L63/00
Inventor 郑成仑金道显李宰源金永一
Owner SDS