Preparation method of phenolic hydroxyl group containing polyimide powder

A technology of phenolic hydroxyl polyimide containing phenolic hydroxyl groups, which is applied in the field of preparation of high-temperature-resistant high-performance aromatic heterocyclic polymer powders, can solve the problems of difficult wastewater treatment, strong pungent odor, and high production costs, and achieve effective Conducive to environmental protection, easy solvent recovery, and product cost reduction effects
CN1927908AInactive Publication Date: 2007-03-14DONGHUA UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DONGHUA UNIV
Publication Date
2007-03-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The preparation process of phenolic hydroxyl group-containing polyimide powder includes the following steps: 1. reaction of phenolic hydroxyl group-containing aromatic diamine compound or its mixture with other diamine compound and aromatic binary anhydride in the molar ratio of 1 to 1 in strong polar non-protonic organic solvent under protection of nitrogen at 0-30 deg.c for 3-12 hr to obtain transparent ropy polyhydroxy amido acid solution; and 2. adding azeotropic dewatering agent in nitrogen atmosphere and heating to 120-160 deg.c to reflux, azeotropically dewater and imidize for 5-18 hr, cooling to room temperature, washing and vacuum drying to obtain phenolic hydroxyl group-containing polyimide powder. The industrial production process has environment friendship, simple operation, low cost and easy solvent recovery.
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Description

technical field

[0001] The invention relates to a preparation method of a high-temperature-resistant high-performance aromatic heterocyclic polymer powder containing active phenolic hydroxyl reactive groups, in particular to a preparation method of a phenolic hydroxyl-containing polyimide powder. Background technique

[0002] Polyimide is a class of polymers with excellent comprehensive properties. It has excellent heat resistance, low temperature resistance, solvent resistance, self-lubrication, radiation resistance and flame retardancy. At the same time, it also has very good mechanical and dielectric properties. Therefore, it is widely used in high-temperature and radiation-resistant materials such as spacecraft, satellites or space vehicles; advanced structural composite materials in aerospace, automotive, electromechanical, etc., C-level or 200-level electrical insulation materials, high-temperature resistant adhesives etc.; and FPC or PCB base materials in the field o...

Claims

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