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Scaling powder for leadless soldering tin

A technology of lead-free solder and flux, which is applied in the flux field of tin-silver-copper series or tin-copper series lead-free solder, which can solve problems such as harmful to health and difficult to clean

Inactive Publication Date: 2009-01-28
上海华实纳米材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Rosin resin series fluxes are helpful in terms of solderability, but because rosin resin residues after welding are difficult to clean, and a large amount of harmful gas is released during the welding process, which is harmful to health. At present, most of the industry has begun to phase out fluxes containing rosin. product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This is a halogen-free no-clean flux containing organic acids and non-ionic surfactants. The weight percentage of its raw materials is:

[0027] Adipic acid 1.5%;

[0028] Succinic acid 1.0%;

[0029] Dimethyl Nylonate 1.0%;

[0030] Polyethylene glycol monooleate 2.0%;

[0031] Hydroquinone 0.5%; and

[0032] Deionized water 94.0%.

[0033] Tested in accordance with the Japanese Industrial Standard JIS Z3197-99, this example has less residue after welding, is non-corrosive, has good electrical properties, and is suitable for a variety of lead-free soldering processes.

Embodiment 2

[0035] This is a halogen-free no-clean flux containing organic acids and non-ionic surfactants. The weight percentage of its raw materials is:

[0036] Adipic acid 1.0%;

[0037] Succinic acid 2.0%;

[0038] Dimethyl Nylonate 4.0%;

[0039] Polyethylene glycol monooleate 2.0%;

[0040] Hydroquinone 0.1%; and

[0041] Deionized water 90.9%.

[0042] It is tested according to the standard of JIS Z3197-99. This example has less residue after welding, is non-corrosive, and has good electrical properties. It is suitable for a variety of lead-free soldering processes.

Embodiment 3

[0044] This is a halogen-free no-clean flux containing organic acids and non-ionic surfactants. The weight percentage of its raw materials is:

[0045] Adipic acid 2.5%;

[0046] Succinic acid 2.5%;

[0047] Dimethyl nylon acid 0.5%;

[0048] Polyethylene glycol monooleate 4.0%;

[0049] Hydroquinone 0.5%; and

[0050] Deionized water 90.0%.

[0051] It is tested according to the standard of JIS Z3197-99. This example has less residue after welding, is non-corrosive, and has good electrical properties. It is suitable for a variety of lead-free soldering processes.

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PUM

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Abstract

The invention relates to a scaling powder used for lead-free soldering tin which comprises the matters calculated according to the following weight percentage: 0.1 to 5.0 percent of adipate, 0.1 to 5.0 percent of butane diacid, 0.5 to 10.0 percent of DBE, 0.5 to 10.0 percent of polyethyleneglycol monoleate, 0.01 to 1.0 percent of hydroquinone; the rest is deionized water. The scaling powder used for lead-free soldering tin of the invention has the advantages of less residue after welding, no corrosion and good electric performance, thus can improve the practical performances of the scaling powder; besides, the scaling powder used for lead-free soldering tin of the invention does not add the matters of halogen compound, alcohol and aether latent solvents, abietic resin, and the like, so as to ensure no damage is caused to human body and the environment.

Description

technical field [0001] The invention relates to a flux for lead-free solder, in particular to a flux suitable for tin-silver-copper (SnAgCu) series or tin-copper (SnCu) series lead-free solder. Background technique [0002] Due to the popularization and application of lead-free solder products, how to effectively improve the solderability of the soldering process has become the focus of attention in the industry. Because the solderability of lead-free solder is much worse than that of traditional tin-lead solder, in addition to improving the lead-free solder formula, people also seek improvements in the flux formula in order to obtain efficient flux to meet the soldering process . [0003] Traditional fluxes generally contain halogen compound formulations to improve the solderability of the soldering process. The use of dibromosuccinic acid is mentioned in the "no-clean lead-free solder flux" of Chinese invention patent announcement number 1562554 and "a low solid content ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362
Inventor 陈跃华吴以舜
Owner 上海华实纳米材料有限公司