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Non-halogen scaling powder for leadless solder

A technology of lead-free solder wire and lead-free solder, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve environmental hazards and other problems, achieve less residue after soldering, improve solderability, insulation The effect of high resistance

Inactive Publication Date: 2011-01-12
上海华实纳米材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Another example is Chinese Invention Patent No. 101049662, which uses compounds such as dibromobutene diol in the "Lead-free Solder Wire Use Halogen-Free Flux and Preparation Method". These compounds also belong to halogen compounds and will cause harm to the environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The halogen-free soldering flux that the lead-free solder wire of the present embodiment is used, the weight percent of its raw material content is:

[0021] Adipic acid 1%;

[0022] Glutaric acid 2%;

[0023] Dimethyl Nylonate 1%;

[0024] Polyethylene glycol monooleate 2%;

[0025] Polyethylene glycol (6000 Dalton) 94.0%.

[0026] Specific preparation method: First, dissolve adipic acid, glutaric acid, dimethyl nylon acid, and polyethylene glycol monooleate into a certain amount of ethanol solution and stir evenly; then inject the mixed solution and heat it to 120°C In polyethylene glycol (6000Dalton) and stirred for more than 30 minutes to make it evenly mixed, the ethanol was completely volatilized and set aside. Finally, the obtained flux is heated and pressed into the tin wire through an extruder, and then lead-free solder wires of various specifications are drawn out through a wire drawing machine.

[0027] Using the test standard in IPC-TM-650 to test lead-...

Embodiment 2

[0029] The halogen-free soldering flux that the lead-free solder wire of the present embodiment is used, the weight percent of its raw material content is:

[0030] Adipic acid 1%;

[0031] Succinic acid 2%;

[0032] Polyethylene glycol monostearate 5%;

[0033] Octacosyl Alcohol 92%.

[0034] Specific preparation method: First, dissolve adipic acid, succinic acid, and polyethylene glycol monostearate in a certain amount of ethanol solution and stir evenly; then inject the mixed solution into octacosanol heated to 120°C and stir for more than 30 minutes to make it evenly mixed and the ethanol is completely volatilized for later use. Finally, the obtained flux is heated and pressed into the tin wire through an extruder, and then lead-free solder wires of various specifications are drawn out through a wire drawing machine.

[0035] Using the test standard in IPC-TM-650 to test lead-free solder wire, its spreading rate is greater than 75%, less residue after welding, high ins...

Embodiment 3

[0037] The halogen-free soldering flux that the lead-free solder wire of the present embodiment is used, the weight percent of its raw material content is:

[0038] Azelaic acid 3%;

[0039] Succinic acid 1%;

[0040] Polyethylene glycol monooleate 5%;

[0041] Sorbitol 50%;

[0042] Polyethylene glycol (20000 Dalton) 41%.

[0043] Specific preparation method: First, dissolve azelaic acid, succinic acid, and polyethylene glycol monooleate in a certain amount of ethanol solution and stir evenly; then inject the mixed solution into sorbitol and polyethylene glycol heated to 120°C Alcohol (20000Dalton) mixed solution and stirred for more than 30 minutes to make it evenly mixed and the ethanol was completely volatilized for later use. Finally, the obtained flux is heated and pressed into the tin wire through an extruder, and then lead-free solder wires of various specifications are drawn out through a wire drawing machine.

[0044] Using the test standard in IPC-TM-650 to tes...

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PUM

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Abstract

The invention relates to a non-halogen scaling powder used for a stick of a lead-free soldering tin which comprises 0.5 to 10.0 percent of organic acid that is selected from butane diacid, adipate, pentane diacid, nonane diacid, decanedioic acid, citric acid, salicylic acid, glycollic acid and malic acid; 0.5 to 20.0 percent of fatty acid ester surface active agent that is selected from dimethyl niacin, polyethyleneglycol monoleate, polyglycol monostearate, dimethyl succinate; the rest percent of organic alcohol that is selected from fatty alcohol and polyethyleneglycol with high melting point. The scaling powder of the invention does not add halogen compounds, thus ensuring no harm is caused to the environment; the residue after welding is less; a bronze mirror has no corrosion and no poison and no irritating gas are generated; besides, the non-halogen scaling powder of the invention has excellent welding effect.

Description

technical field [0001] The invention relates to a halogen-free flux for lead-free solder wire, in particular to a flux suitable for tin-silver-copper (SnAgCu) series or tin-copper (SnCu) series lead-free solder flux. Background technique [0002] Due to the popularization and application of lead-free solder products, how to effectively improve the solderability of the soldering process has become the focus of attention in the industry. Because the solderability of lead-free solder is much worse than that of traditional tin-lead solder, in addition to improving the lead-free solder formula, people also seek improvements in the flux formula in order to obtain high-efficiency flux to meet the soldering process. [0003] Traditional fluxes for soldering wire generally use rosin as the matrix, such as the Chinese Invention Patent No. 101157168 "Rosin-type Halogen-Free No-cleaning Flux for Lead-Free Solder Wires" uses modified rosin as the matrix of the flux, but the high temperat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
Inventor 陈跃华吴以舜
Owner 上海华实纳米材料有限公司