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Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board

An ejection method and technology of liquid ejection head, applied in the direction of printing, etc., can solve the problems of dirty surrounding environment, inability of ink droplets to reach the predetermined position, and reduced clarity.

Inactive Publication Date: 2009-01-28
NAT INST OF ADVANCED IND SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the ink drop cannot reach the predetermined position
This causes phenomena such as loss of clarity and smearing, where scattered ink makes the surroundings dirty

Method used

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  • Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board
  • Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board
  • Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0171] (Overall structure of liquid ejecting equipment)

[0172] Next, a liquid ejecting apparatus 10 as an embodiment of the present invention will be described with reference to FIGS. 11-14C. FIG. 11 is a block diagram schematically showing the structure of the liquid ejection device 10 .

[0173] The liquid ejection apparatus 10 includes a carrier K, a liquid ejection mechanism 50 for ejecting charged solution droplets on the carrier K, a thermostat 41 for accommodating the liquid ejection mechanism 50 and the carrier K on which the ejected droplets land, air Regulator 70, which serves as a unit for regulating the spraying environment, for regulating the temperature and humidity of the environment inside the thermostat 41, an air filter for filtering dust in the air circulating between the thermostat 41 and the air conditioner 70 42, a differential pressure gauge 43 for detecting the pressure difference between the inside and outside of the thermostat 41, a flow control va...

no. 2 example

[0270] Refer below Figure 18 The liquid ejection mechanism 101 according to the second embodiment of the electrostatic attraction type liquid ejection apparatus is explained. Figure 18 It is a schematic diagram showing main parts of the liquid ejection mechanism 101 . The nozzle 51 is shown facing downward in the same manner as in actual use. Among them, the same elements as those of the above-mentioned liquid ejection mechanism 50 are denoted by the same reference numerals, and their repeated descriptions are omitted.

[0271] It is assumed that the liquid ejection mechanism 101 is not used within the thermostat 41 which can be set to a suitable dew point, unlike the liquid ejection mechanism 50 described above. Therefore, the liquid ejection mechanism 101 suppresses the influence from the uneven potential distribution on the surface of the carrier using a method different from that used in the liquid ejection mechanism 50 .

[0272] Such as Figure 18 As shown, the liq...

no. 3 example

[0294] Refer below Figure 20 A liquid ejection mechanism 201 according to a third embodiment of the electrostatic attraction type liquid ejection apparatus will be described.

[0295] (the difference)

[0296] Such as Figure 20 As shown, the liquid ejection mechanism 201 is used outside the thermostat 41 as in the liquid ejection mechanism 101 , and includes the liquid ejection head 56 , and an ejection voltage applying unit having a charging unit 204 . The liquid ejection head 56 has the same structure as that of the second embodiment, but the ejection voltage applying unit having the charging unit 204 is different from that of the second embodiment. While the ejection voltage applying unit having the charging unit 104 applies a stable voltage in the second embodiment, the ejecting voltage applying unit having the charging unit 204 applies a pulse voltage in the third embodiment.

[0297] The ejection voltage applying unit having the charging unit 204 includes a stabiliz...

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PUM

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Abstract

A liquid jetting device, comprising a liquid jetting head (56) having a nozzle (51) jetting the charged droplets of a solution from the tip part thereof, a jetting electrode (58) fitted to the liquid jetting head and to which a voltage generating a filed for jetting the droplets is applied, a voltage application means (35) applying voltage to the jetting electrode, a base material (K) formed of an insulating material receiving the jetting of the droplets, and a jetting atmosphere control means (70) maintaining an atmosphere for jetting the droplets from the liquid jetting head at a dew point temperature of 9 DEG C or higher and less than the saturated temperature of water.

Description

[0001] This application is a divisional application of the patent application with the application number 200480025744.3, the application date is July 29, 2004, and the invention title is "liquid ejection device and method thereof, and method for forming wiring pattern of circuit board". technical field [0002] The present invention relates to a liquid ejecting apparatus for ejecting liquid on a carrier, a liquid ejecting method, and a method for forming a wiring pattern on a circuit board. Background technique [0003] There is known an electrostatic attraction type inkjet printer as described in Patent Publication 1. This type of inkjet printer includes a plurality of raised ink conduits, each of which ejects ink from a tip portion, opposing electrodes disposed against the respective tips of the ink ejection conduits and grounded, and a The ink is applied to the ejection electrode of the ejection voltage. In addition, two kinds of raised ink conduits were prepared, each ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/14B41J2/06
Inventor 岩下广信山本和典西尾茂村田和广
Owner NAT INST OF ADVANCED IND SCI & TECH