Method for detecting electrical property of conductivity lead wire of glass substrate of liquid crystal display

Abstract

The invention discloses an electrical performance detecting method for the conductive leads of an LCD screen glass substrate; the method comprises the following steps: the conductive leads on the glass substrate of the LCD screen are divided into column driver leads and row driver leads corresponding to the column electrodes and row electrodes of a drive chip respectively; the column diver leads are stretched upwards the glass substrate, and the row driver leads are stretched towards both sides of the glass substrate; a liquid crystal box is made with an ordinary glass substrate and a glass substrate with the diver leads being stretched; and a detection device is used to input detection signals to the stretched column driver leads and row driver leads so as to get the testing result basedon the feedback images from the liquid crystal box. The method enables the conductive leads of the LCD screen glass substrate to be completely stretched to appropriate locations according to needs, so as to achieve the electrical performance detection of all the conductive leads on the LCD screen glass substrate.

Description

technical field [0001] The invention relates to a method for detecting electrical properties of a conductive lead wire of a liquid crystal display glass substrate. Background technique [0002] Liquid crystal displays generally require chips to be driven. Existing liquid crystal displays generally bond the chip on the glass substrate of the liquid crystal display by way of Chip On Glass (COG) to form a liquid crystal display module (LCD). Module, referred to as LCM). Specifically, the chip (IC) is fixed on the glass substrate of the liquid crystal display through an anisotropic conductive film (ACF), and then the chip drives the liquid crystal display to complete the display. The conductive leads on the glass substrate of the liquid crystal display bonded in this way are densely distributed. Generally, the interval between the conductive leads is only about 15 microns, and the smallest interval is even only 12 microns. Therefore, in the production process, short-circuit de...

AI Technical Summary

Problems solved by technology

This detection method is an important means of quality control in the production process of LCD screens, but it has the following limitations: 1. High cost

The price of this pattern detection equipment is as high as several million RMB, and the probes are expensive (the price of a probe is as high as 30 U.S. dollars, and a pattern detection equipment generally needs 60 probes). In addition, the probes are easily damaged, further Raised the cost

2. The detection speed is slow, and it takes a long time to debug the probe, which limits the production capacity

3. The detection is not complete, and it is easy to miss the inspection phenomenon, so that the defective products flow into the next process

4. The detection accuracy is not enough. Generally, the detection accuracy of this equipment is 50 microns, and it is impossible to detect short-circuit defects for products below 50 microns.

5. During the short-circuit detection process, it is easy to scratch the conductive leads and glass, resulting in new defects

However, this invention patent application also has the following defects: during the test process, because the position of the lead wire is concentrated in the IC bonding area, it is very close to other lines of the LCD screen, and misjudgment is prone to occur

During the test, because the position of the leads is concentrated in the IC bonding area, and the IC bonding area is very narrow, sometimes all the odd or even numbered leads cannot be stretched to the IC bonding area. The conductive leads cannot be detected. Total short-circuit defect of conductive leads on substrate

In addition, in the patent application for this invention, conductive adhesive strips are used to electrically connect the stretched conductive leads. The alignment between the conductive adhesive strips and the conductive leads is relatively difficult, and misjudgment is prone to occur.

Moreover, the conductive adhesive strip is elastic and easy to deform, so the test fixture is unstable and often needs to be re-adjusted, which affects production efficiency, and the deformation of the conductive adhesive strip may cause its connection with the conductive lead to be unreliable and affect the test results.

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