High-power LED encapsulation construction

Abstract

A high-power LED packaging structure includes a heat conducting base plate, a plurality of electrical pins and at least one high-power LED, wherein the heat conducting base plate is provided with a circuit board, a metal plate and a connecting piece used for connecting the circuit board and the metal plate; a plurality of punching holes penetrating the circuit board and the metal plate are formed on the heat conducting base plate; the electrical pins are respectively accommodated in the punching holes, and part of the electrical pins penetrate out of the punching holes; and the high-power LED is arranged on the metal plate, and electrically connected to the circuit board via a plurality of metal weld lines and electrical pins, so as to carry out the heat dissipation of the high-power LED by the metal plate with good heat-conducting effect.

Description

technical field [0001] The present invention is related to the package structure of high-power LED, more specifically, refers to a package structure of high-power LED with better heat dissipation. Background technique [0002] Press, as far as the current general high-power LED (light-emitting diode) packaging structure is concerned, such as figure 1 As shown, it mainly has a metal circuit board 1 and a high-power LED 2. The metal circuit board 1 has a metal plate 3, an insulating layer 4 arranged on the metal plate 3 and an insulating layer 4 arranged on the insulating layer 4. The circuit layer 5, the high-power LED 2 is arranged on the circuit layer 5, and is electrically connected (soldered) to the circuit layer 5 by a plurality of metal welding wires 6, so that the high-power LED is conducted by the circuit layer 5 2, so that the high-power LED 2 can emit light. [0003] Since the brightness of high-power LEDs is brighter than that of conventional small LEDs, but the ...

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Problems solved by technology

[0003] Since the brightness of high-power LEDs is brighter than that of conventional small LEDs, but the temperature generated by them is also relatively high. In terms of the above-mentioned packaging structure, the heat energy generated by the high-power LEDs 2 will be directly conducted to the circuit layer 5 However, because the circuit layer 5 needs to supply current to pass through, the circuit layer 5 itself has a considerable temperature, and it is difficult to conduct the temperature of the high-power LED 2. Although the thermal conductivity of the metal plate 3 is better, because the metal plate 3 The insulating layer 4 is separated from the circuit layer 5, and the thermal conductivity of the insulating layer 4 is extremely low, so the temperature of the circuit layer 5 is difficult to conduct to the metal plate 3, so that the overall thermal conductivity is not good

In this way, when the temperature of the high-power LED 2 cannot be conducted out (heat dissipation) and continues to rise, its brightness will be affected and subsequently decreased. Moreover, when the temperature of the high-power LED 2 continues to be in a high temperature state for a long time It will also lead to a significant shortening of the service life

[0004] In addition, other LED heat dissipation substrates, such as ceramic substrates, have good thermal conductivity and low dielectric constant, but the disadvantage is that the price is relatively high, and they cannot be widely used at present. They are only used in high-end products.

Therefore, the traditional packaging method generally has the disadvantages of poor heat dissipation and high cost.

[0005] In addition, the traditional heat dissipation substrate is also unable to provide a good reflective surface due to the relationship between the circuit process, so that the light reflection effect generated by the LED grain is not good, and the light generated by the LED cannot be effectively used, that is, Unable to improve the light utilization efficiency of LED

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